Inventor · disambiguated record
Nils D. Hoivik
Also filed as: HOIVIK NILS · HOIVIK NILS D · HOIVIK NILS DENEKE
14 granted patents·3 pending applications·155 citations·filing 2002–2017
92Inventor score
Top patents by PatentIndex Score
17 records- 0193US7422983B2Ta-TaN selective removal process for integrated device fabricationIBM·Filed 2005·Granted Sep 9, 2008·16 cites·17 claims
- 0292US7808798B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2008·Granted Oct 5, 2010·27 cites·14 claims
- 0392US7518229B2Versatile Si-based packaging with integrated passive components for mmWave applicationsIBM·Filed 2006·Granted Apr 14, 2009·31 cites·3 claims
- 0486US7426067B1Atomic layer deposition on micro-mechanical devicesUNIV COLORADO·Filed 2002·Granted Sep 16, 2008·45 cites·15 claims
- 0583US7394657B2Method of obtaining enhanced localized thermal interface regions by particle stackingIBM·Filed 2006·Granted Jul 1, 2008·10 cites·18 claims
- 0682US8865597B2Ta—TaN selective removal process for integrated device fabricationIBM·Filed 2013·Granted Oct 21, 2014·3 cites·11 claims
- 0782US7876565B2Method of obtaining enhanced localized thermal interface regions by particle stackingIBM·Filed 2008·Granted Jan 25, 2011·9 cites·19 claims
- 0880US7192868B2Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the sameIBM·Filed 2005·Granted Mar 20, 2007·7 cites·26 claims
- 0978US8426316B2Ta-TaN selective removal process for integrated device fabricationCOTTE JOHN MICHAEL·Filed 2008·Granted Apr 23, 2013·4 cites·5 claims
- 1072US10308506B2Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devicesIBM·Filed 2016·Granted Jun 4, 2019·1 cites·5 claims
- 1162US8338920B2Package integrated soft magnetic film for improvement in on-chip inductor performanceCOTTE JOHN MICHAEL·Filed 2007·Granted Dec 25, 2012·2 cites·20 claims
- 1261US11111136B2Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devicesIBM·Filed 2017·Granted Sep 7, 2021·0 cites·6 claims
- 1357US2008066860A1Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATIONIBM·Filed 2007·Application pending·0 cites
- 1457US2008067683A1Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATIONIBM·Filed 2007·Application pending·0 cites
- 1552US8541854B2Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structureCOTTE JOHN M·Filed 2012·Granted Sep 24, 2013·0 cites·20 claims
- 1649US8163584B2Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structureLU MINHUA·Filed 2008·Granted Apr 24, 2012·0 cites·11 claims
- 1727US2012321907A1Bonding process for sensitive micro- and nano-systemsHOIVIK NILS·Filed 2011·Application pending·0 cites
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