Inventor · disambiguated record
Gwang Kim
Also filed as: KIM GWANG · KIM GWANG HO
8 granted patents·1 pending application·187 citations·filing 1999–2020
87Inventor score
Top patents by PatentIndex Score
9 records- 0196US7368319B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted May 6, 2008·70 cites·20 claims
- 0293US7420269B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Sep 2, 2008·34 cites·18 claims
- 0388US7498667B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 3, 2009·20 cites·20 claims
- 0485US8089145B1Semiconductor device including increased capacity leadframeKIM GWANG HO·Filed 2008·Granted Jan 3, 2012·20 cites·20 claims
- 0573US8125076B2Semiconductor package system with substrate heat sinkKIM GWANG·Filed 2005·Granted Feb 28, 2012·9 cites·20 claims
- 0656US6512826B1Multi-directional hand-free kitWESTECH KOREA INC·Filed 1999·Granted Jan 28, 2003·34 cites·14 claims
- 0747US7947535B2Thin package system with external terminalsSTATS CHIPPAC LTD·Filed 2005·Granted May 24, 2011·0 cites·10 claims
- 0836US2022057274A1Patch type thermometer and application product for sameNBST CO LTD·Filed 2020·Application pending·0 cites
- 0933US10081882B2Portable apparatus for surface inspection and electrolytic polishingFRONTICS INC·Filed 2015·Granted Sep 25, 2018·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →