Inventor · disambiguated record
Antonio B. Dimaano, Jr.
Also filed as: DIMAANO ANTONIO · DIMAANO ANTONIO B · DIMAANO ANTONIO B JR · DIMAANO JR ANTONIO B
36 granted patents·9 pending applications·328 citations·filing 2000–2024
97Inventor score
Files withSTATS CHIPPAC LTD17ADVANPACK SOLUTIONS PTE LTD5Nexperia BV5UTAC HEADQUARTERS PTE LTD4CHOW SENG GUAN3
Top patents by PatentIndex Score
45 records- 0196US8106500B2Stackable integrated circuit package systemCHOW SENG GUAN·Filed 2010·Granted Jan 31, 2012·28 cites·10 claims
- 0294US7385299B2Stackable integrated circuit package system with multiple interconnect interfaceSTATS CHIPPAC LTD·Filed 2006·Granted Jun 10, 2008·31 cites·17 claims
- 0393US7456496B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2005·Granted Nov 25, 2008·48 cites·16 claims
- 0492US7556987B2Method of fabricating an integrated circuit with etched ring and die paddleSTATS CHIPPAC LTD·Filed 2006·Granted Jul 7, 2009·24 cites·4 claims
- 0591US7830020B2Integrated circuit package system employing device stackingSTATS CHIPPAC LTD·Filed 2007·Granted Nov 9, 2010·19 cites·15 claims
- 0690US8421197B2Integrated circuit package system with warp-free chipDO BYUNG TAI·Filed 2011·Granted Apr 16, 2013·9 cites·10 claims
- 0790US7141886B2Air pocket resistant semiconductor packageSTATS CHIPPAC LTD·Filed 2005·Granted Nov 28, 2006·21 cites·5 claims
- 0886US7479692B2Integrated circuit package system with heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Jan 20, 2009·13 cites·20 claims
- 0982US7986043B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 26, 2011·11 cites·20 claims
- 1081US7892894B2Method of manufacturing integrated circuit package system with warp-free chipSTATS CHIPPAC LTD·Filed 2007·Granted Feb 22, 2011·8 cites·10 claims
- 1179US7545032B2Integrated circuit package system with stiffenerSTATS CHIPPAC LTD·Filed 2006·Granted Jun 9, 2009·8 cites·20 claims
- 1278US6929981B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 16, 2005·26 cites·10 claims
- 1377US7777320B2Quad flat pack in quad flat pack integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Aug 17, 2010·4 cites·16 claims
- 1477US6734039B2Semiconductor chip grid array package design and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·28 cites·19 claims
- 1574US7981702B2Integrated circuit package in package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 19, 2011·5 cites·10 claims
- 1673US8422243B2Integrated circuit package system employing a support structure with a recessCHOW SENG GUAN·Filed 2006·Granted Apr 16, 2013·5 cites·10 claims
- 1773US7541222B2Wire sweep resistant semiconductor package and manufacturing method thereforSTATS CHIPPAC LTD·Filed 2006·Granted Jun 2, 2009·5 cites·20 claims
- 1872US8536689B2Integrated circuit package system with multi-surface die attach padDIMAANO JR ANTONIO B·Filed 2005·Granted Sep 17, 2013·8 cites·20 claims
- 1972US8232658B2Stackable integrated circuit package system with multiple interconnect interfaceCHOW SENG GUAN·Filed 2008·Granted Jul 31, 2012·4 cites·20 claims
- 2072US7863108B2Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jan 4, 2011·4 cites·15 claims
- 2171US7741707B2Stackable integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jun 22, 2010·4 cites·10 claims
- 2270US7936055B2Integrated circuit package system with interlockSTATS CHIPPAC LTD·Filed 2006·Granted May 3, 2011·4 cites·20 claims
- 2367US9564387B2Semiconductor package having routing traces thereinUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Feb 7, 2017·1 cites·19 claims
- 2465US10573590B2Multi-layer leadless semiconductor package and method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Feb 25, 2020·1 cites·11 claims
- 2562US8513542B2Integrated circuit leaded stacked package systemKUAN HEAP HOE·Filed 2006·Granted Aug 20, 2013·2 cites·13 claims
- 2660US8178394B2Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereofMERILO DIOSCORO A·Filed 2010·Granted May 15, 2012·1 cites·18 claims
- 2759US8120187B2Integrated circuit package system employing device stacking and method of manufacture thereofDAHILIG FREDERICK RODRIGUEZ·Filed 2010·Granted Feb 21, 2012·1 cites·15 claims
- 2859US7928540B2Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Granted Apr 19, 2011·1 cites·20 claims
- 2959US2024096765A1Reduced stress clip for semiconductor dieNexperia BV·Filed 2023·Application pending·0 cites
- 3058US8174127B2Integrated circuit package system employing device stackingDAHILIG FREDERICK RODRIGUEZ·Filed 2011·Granted May 8, 2012·1 cites·20 claims
- 3158US2024404923A1Die paddleNexperia BV·Filed 2024·Application pending·0 cites
- 3254US2025132289A1Method of manufacturing semiconductor assembliesNexperia BV·Filed 2024·Application pending·0 cites
- 3354US2024282680A1Die paddle standoffs in semiconductor packagesNexperia BV·Filed 2024·Application pending·0 cites
- 3452US2024145354A1Semiconductor device and a method for manufacturing such semiconductor deviceNexperia BV·Filed 2023·Application pending·0 cites
- 3550US6543127B1Coplanarity inspection at the singulation processST ASSEMBLY TEST SERVICE LTD·Filed 2000·Granted Apr 8, 2003·3 cites·14 claims
- 3646US9472532B2Leadframe area array packaging technologyUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted Oct 18, 2016·0 cites·24 claims
- 3743US9023690B2Leadframe area array packaging technologyDIMAANO JR ANTONIO BAMBALAN·Filed 2012·Granted May 5, 2015·0 cites·23 claims
- 3843US7482683B2Integrated circuit encapsulation system with ventSTATS CHIPPAC LTD·Filed 2006·Granted Jan 27, 2009·0 cites·20 claims
- 3940US10658277B2Semiconductor package with a heat spreader and method of manufacturing thereofUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted May 19, 2020·0 cites·19 claims
- 4040US2006043612A1Wire sweep resistant semiconductor package and manufacturing method thereofSTATS CHIPPAC LTD·Filed 2004·Application pending·0 cites
- 4139US2008284038A1Integrated circuit package system with perimeter paddleDIMAANO JR ANTONIO B·Filed 2007·Application pending·0 cites
- 4235US10714431B2Semiconductor packages with electromagnetic interference shieldingUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 4335US2005087883A1Flip chip package using no-flow underfill and method of fabricationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Application pending·0 cites
- 4434US2004108580A1Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 4530US8274145B2Semiconductor package system with patterned mask over thermal reliefALABIN LEOCADIO M·Filed 2007·Granted Sep 25, 2012·0 cites·20 claims
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