Wire sweep resistant semiconductor package and manufacturing method thereof

Abstract

A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied to the conductive wires and optionally the die to prevent wire sweep, the sealant being applied free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are enclosed in an encapsulant.

1 . A method for manufacturing a wire sweep resistant semiconductor package, comprising: 
 providing a die attached to an interposer;    electrically connecting the die to the interposer with conductive wires;    applying a sealant to the conductive wires and optionally the die to prevent wire sweep, the sealant being applied free of contact with the interposer; and    encapsulating the die, the interposer, the conductive wires, and the sealant in an encapsulant.    
     
     
         2 . The method of  claim 1  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises applying the sealant to the conductive wires with the sealant completely covering the conductive wires and touching only the conductive wires.  
     
     
         3 . The method of  claim 1  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises applying discrete drops of the sealant to distinct groups of the conductive wires with each drop of the sealant touching only a respective distinct group of the conductive wires.  
     
     
         4 . The method of  claim 1  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises: 
 applying a first application of the sealant to the conductive wires with the first application of the sealant touching only the conductive wires; and    applying a second application of the sealant to substantially the same conductive wires with the second application of the sealant touching only the conductive wires.    
     
     
         5 . The method of  claim 1  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises applying the sealant to the die and the conductive wires with the sealant entirely covering the die and touching only the die and the conductive wires.  
     
     
         6 . A method for manufacturing a wire sweep resistant semiconductor package, comprising: 
 providing a die attached by an epoxy to a interposer;    electrically connecting the die to the interposer with conductive wires connected around the periphery of the die;    applying a sealant to the conductive wires and optionally the die to prevent wire sweep, the sealant being applied free of contact with the interposer; and    encapsulating the die, the epoxy, the interposer, the conductive wires, and the sealant in an encapsulant.    
     
     
         7 . The method of  claim 6  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises applying the sealant to the conductive wires with the sealant completely covering the conductive wires and touching only the conductive wires.  
     
     
         8 . The method of  claim 6  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises: 
 applying a first drop of the sealant to a first group of conductive wires, the first drop of the sealant touching only the first group of conductive wires;    applying a second drop of the sealant to a second group of conductive wires, the second drop of the sealant touching only the second group of conductive wires;    applying a third drop of the sealant to a third group of conductive wires, the third drop of the sealant touching only the third group of conductive wires; and    applying a fourth drop of the sealant to a fourth group of conductive wires, the fourth drop of the sealant touching only the fourth group of conductive wires.    
     
     
         9 . The method of  claim 6  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises: 
 applying a first application of the sealant to the conductive wires with the first application of the sealant touching only the conductive wires; and    applying a second application of the sealant to substantially the same conductive wires with the second application of the sealant touching only the conductive wires.    
     
     
         10 . The method of  claim 6  wherein applying the sealant to the conductive wires and optionally the die to prevent wire sweep further comprises applying the sealant to the die and the conductive wires with the sealant entirely covering the die, covering the wires at their connected positions on the die, and touching only the die and the conductive wires.  
     
     
         11 . A wire sweep resistant semiconductor package, comprising: 
 a die attached to an interposer;    conductive wires electrically connecting the die to the interposer;    a sealant applied to the conductive wires and optionally the die to prevent wire sweep, the sealant being free of contact with the interposer; and    an encapsulant encapsulating the die, the interposer, the conductive wires, and the sealant.    
     
     
         12 . The semiconductor package of  claim 11  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises a sealant that touches only the conductive wires.  
     
     
         13 . The semiconductor package of  claim 11  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises discrete drops of the sealant applied to distinct groups of conductive wires with each drop of the sealant touching only a respective distinct group of the conductive wires.  
     
     
         14 . The semiconductor package of  claim 11  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises: 
 a first application of the sealant applied to the conductive wires to prevent wire sweep, the first application of the sealant touching only the conductive wires; and    a second application of the sealant applied to substantially the same conductive wires to prevent wire sweep, the second application of the sealant touching only the conductive wires.    
     
     
         15 . The semiconductor package of  claim 11  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises the sealant entirely covering the die and touching only the die and the conductive wires.  
     
     
         16 . A wire sweep resistant semiconductor package, comprising: 
 a die;    an interposer;    an epoxy attaching the die to the interposer;    conductive wires around the periphery of the die electrically connecting the die to the interposer;    a sealant applied to the conductive wires and optionally the die to prevent wire sweep, the sealant being free of contact with the interposer; and    an encapsulant encapsulating the die, the epoxy, the interposer, the conductive wires, and the sealant.    
     
     
         17 . The semiconductor package of  claim 16  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises the sealant completely covering the conductive wires and touching only the conductive wires.  
     
     
         18 . The semiconductor package of  claim 16  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises: 
 a first drop of the sealant applied to a first group of conductive wires, the first drop of the sealant touching only the first group of conductive wires;    a second drop of the sealant applied to a second group of conductive wires, the second drop of the sealant touching only the second group of conductive wires;    a third drop of the sealant applied to a third group of conductive wires, the third drop of the sealant touching only the third group of conductive wires; and    a fourth drop of the sealant applied to a fourth group of conductive wires, the fourth drop of the sealant touching only the fourth group of conductive wires.    
     
     
         19 . The semiconductor package of  claim 16  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises: 
 a first application of the sealant applied to the conductive wires to prevent wire sweep, the first application of the sealant touching only the conductive wires; and    a second application of the sealant applied to substantially the same conductive wires to prevent wire sweep, the second application of the sealant touching only the conductive wires.    
     
     
         20 . The semiconductor package of  claim 16  wherein the sealant applied to the conductive wires and optionally the die to prevent wire sweep further comprises the sealant entirely covering the die, covering the wires at their connected positions on the die, and touching only the die and the conductive wires.