Inventor · disambiguated record
Keita Fukutani
Also filed as: FUKUTANI KEITA
6 granted patents·6 pending applications·15 citations·filing 2011–2024
75Inventor score
Top patents by PatentIndex Score
12 records- 0179US8547697B2Fixing structure and fixing method of circuit board with embedded electronic parts to coolerFUKUTANI KEITA·Filed 2011·Granted Oct 1, 2013·7 cites·18 claims
- 0277US9224662B2Semiconductor apparatusTOYOTA MOTOR CO LTD·Filed 2014·Granted Dec 29, 2015·4 cites·10 claims
- 0364US8497572B2Semiconductor module and method of manufacturing the sameFUKUTANI KEITA·Filed 2011·Granted Jul 30, 2013·3 cites·26 claims
- 0462US2025105081A1Semiconductor device and power control unitDENSO CORP·Filed 2024·Application pending·0 cites
- 0559US10103090B2Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 16, 2018·1 cites·12 claims
- 0654US11545419B2Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminalsTOYOTA MOTOR CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·5 claims
- 0752US2024274511A1Semiconductor moduleDENSO CORP·Filed 2024·Application pending·0 cites
- 0851US2016315037A1Semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 0945US2024072045A1Semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1044US2016343630A1Semiconductor device and manufacturing method of the sameTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1139US2016322726A1Terminal connecting structure and semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 1236US9711884B2Terminal connection structure and semiconductor apparatusNISHIHATA MASAYOSHI·Filed 2015·Granted Jul 18, 2017·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →