Inventor · disambiguated record
Masanao Fukuda
Also filed as: FUKUDA MASANAO
6 granted patents·8 pending applications·493 citations·filing 2008–2016
82Inventor score
Files withHITACHI INT ELECTRIC INC6FUKUDA MASANAO2HARA DAISUKE1HIROCHI YUKITOMO1KOKUSAI ELECTRIC CORP1
Top patents by PatentIndex Score
14 records- 0198US9412582B2Reaction tube, substrate processing apparatus, and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 9, 2016·464 cites·14 claims
- 0289US9028614B2Substrate processing apparatusHARA DAISUKE·Filed 2012·Granted May 12, 2015·19 cites·1 claims
- 0385US9074284B2Heat treatment apparatusFUKUDA MASANAO·Filed 2010·Granted Jul 7, 2015·7 cites·12 claims
- 0467US8901013B2Substrate processing apparatus, method of processing substrate and method of manufacturing semiconductor deviceYUASA KAZUHIRO·Filed 2011·Granted Dec 2, 2014·2 cites·15 claims
- 0557US9084298B2Substrate processing apparatus including shielding unit for suppressing leakage of magnetic fieldHIROCHI YUKITOMO·Filed 2011·Granted Jul 14, 2015·1 cites·7 claims
- 0655US2010035440A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 0752US2009029561A1Semiconductor processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 0849US10290494B2Method of manufacturing semiconductor device and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2016·Granted May 14, 2019·0 cites·12 claims
- 0946US2010282166A1Heat treatment apparatus and method of heat treatmentHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 1045US2011253049A1Semiconductor processing apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 1137US2011306212A1Substrate processing apparatus, semiconductor device manufacturing method and substrate manufacturing methodSATO AKIHIRO·Filed 2011·Application pending·0 cites
- 1235US2011065286A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 1334US2012220107A1Substrate processing apparatus, wafer holder, and method of manufacturing semiconductor deviceFUKUDA MASANAO·Filed 2012·Application pending·0 cites
- 1432US2012156886A1Substrate processing apparatus, method of manufacturing substrate, and method of manufacturing semiconductor deviceSHIRAKO KENJI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →