Inventor · disambiguated record
Young Kyu Song
Also filed as: SONG YOUNG · SONG YOUNG K · SONG YOUNG KYU
58 granted patents·22 pending applications·166 citations·filing 2002–2023
98Inventor score
Top patents by PatentIndex Score
80 records- 0194US10653013B1Thin film resistor having surface mounted trimming bridges for incrementally tuning resistanceBOEING CO·Filed 2019·Granted May 12, 2020·7 cites·20 claims
- 0293US9247647B1High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)QUALCOMM INC·Filed 2014·Granted Jan 26, 2016·16 cites·28 claims
- 0391US9472425B2Power distribution improvement using pseudo-ESR control of an embedded passive capacitorQUALCOMM INC·Filed 2015·Granted Oct 18, 2016·8 cites·14 claims
- 0490US10903542B1Variable radio frequency attenuatorBOEING CO·Filed 2020·Granted Jan 26, 2021·3 cites·20 claims
- 0589US9812752B2Flip-chip employing integrated cavity filter, and related components, systems, and methodsQUALCOMM INC·Filed 2016·Granted Nov 7, 2017·6 cites·29 claims
- 0688US9443810B1Flip-chip employing integrated cavity filter, and related components, systems, and methodsQUALCOMM INC·Filed 2015·Granted Sep 13, 2016·6 cites·29 claims
- 0786US9933455B2Known good die testing for high frequency applicationsQUALCOMM INC·Filed 2015·Granted Apr 3, 2018·3 cites·6 claims
- 0886US8987872B2Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packagesQUALCOMM INC·Filed 2013·Granted Mar 24, 2015·8 cites·26 claims
- 0985US9368566B2Package on package (PoP) integrated device comprising a capacitor in a substrateQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·7 cites·20 claims
- 1082US9576718B2Inductor structure in a semiconductor deviceQUALCOMM INC·Filed 2015·Granted Feb 21, 2017·2 cites·30 claims
- 1182US9275876B2Stiffener with embedded passive componentsQUALCOMM INC·Filed 2013·Granted Mar 1, 2016·5 cites·22 claims
- 1282US6896170B2Wire bonder for ball bonding insulated wire and method of using sameMICROBONDS INC·Filed 2002·Granted May 24, 2005·48 cites·19 claims
- 1381US9035421B2High quality factor inductor implemented in wafer level packaging (WLP)QUALCOMM INC·Filed 2013·Granted May 19, 2015·5 cites·54 claims
- 1480US10181410B2Integrated circuit package comprising surface capacitor and ground planeQUALCOMM INC·Filed 2015·Granted Jan 15, 2019·3 cites·18 claims
- 1578US9691694B2Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrateQUALCOMM INC·Filed 2015·Granted Jun 27, 2017·3 cites·33 claims
- 1678US9530739B2Package on package (PoP) device comprising a high performance inter package connectionQUALCOMM INC·Filed 2015·Granted Dec 27, 2016·3 cites·30 claims
- 1778US9502490B2Embedded package substrate capacitorQUALCOMM INC·Filed 2014·Granted Nov 22, 2016·4 cites·14 claims
- 1878US9355963B2Semiconductor package interconnections and method of making the sameQUALCOMM INC·Filed 2014·Granted May 31, 2016·4 cites·30 claims
- 1977US9659850B2Package substrate comprising capacitor, redistribution layer and discrete coaxial connectionQUALCOMM INC·Filed 2014·Granted May 23, 2017·4 cites·19 claims
- 2074US9041212B2Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)QUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·27 claims
- 2171US9093295B2Embedded sheet capacitorQUALCOMM INC·Filed 2013·Granted Jul 28, 2015·2 cites·16 claims
- 2270US10879341B2Integrated device package comprising a real time tunable inductor implemented in a package substrateQUALCOMM INC·Filed 2016·Granted Dec 29, 2020·2 cites·29 claims
- 2370US9385077B2Integrated device comprising coaxial interconnectQUALCOMM INC·Filed 2014·Granted Jul 5, 2016·2 cites·29 claims
- 2469US12016164B1RF filter device for aircraft nacelle access door gapBOEING CO·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 2569US10980122B2Thin film resistor having surface mounted trimming bridges for incrementally tuning resistanceBOEING CO·Filed 2020·Granted Apr 13, 2021·0 cites·20 claims
- 2669US9425143B2Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shieldQUALCOMM INC·Filed 2014·Granted Aug 23, 2016·1 cites·24 claims
- 2768US9490226B2Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signalQUALCOMM INC·Filed 2014·Granted Nov 8, 2016·1 cites·33 claims
- 2867US9806144B2Solenoid inductor in a substrateQUALCOMM INC·Filed 2013·Granted Oct 31, 2017·1 cites·24 claims
- 2967US9628052B2Embedded multi-terminal capacitorQUALCOMM INC·Filed 2014·Granted Apr 18, 2017·2 cites·29 claims
- 3064US10304623B2Integrated device package comprising a tunable inductorQUALCOMM INC·Filed 2016·Granted May 28, 2019·1 cites·20 claims
- 3163US9807884B2Substrate comprising embedded elongated capacitorQUALCOMM INC·Filed 2014·Granted Oct 31, 2017·1 cites·19 claims
- 3263US9583433B2Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layerQUALCOMM INC·Filed 2015·Granted Feb 28, 2017·1 cites·20 claims
- 3363US9245940B2Inductor design on floating UBM balls for wafer level package (WLP)QUALCOMM INC·Filed 2014·Granted Jan 26, 2016·1 cites·23 claims
- 3461US9653533B2Multi-layer interconnected spiral capacitorQUALCOMM INC·Filed 2015·Granted May 16, 2017·1 cites·30 claims
- 3559US11191983B2Fire suppressing deviceBOEING CO·Filed 2018·Granted Dec 7, 2021·0 cites·20 claims
- 3653US11378605B2Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicleBOEING CO·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 3753US9449762B2Embedded package substrate capacitor with configurable/controllable equivalent series resistanceQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·0 cites·9 claims
- 3852US9373583B2High quality factor filter implemented in wafer level packaging (WLP) integrated deviceQUALCOMM INC·Filed 2014·Granted Jun 21, 2016·0 cites·45 claims
- 3952US9335384B2Adjustable magnetic probe for efficient near field scanningQUALCOMM INC·Filed 2013·Granted May 10, 2016·0 cites·20 claims
- 4052US9294064B2Bandpass filter implementation on a single layer using spiral capacitorsQUALCOMM INC·Filed 2013·Granted Mar 22, 2016·0 cites·36 claims
- 4152US9269610B2Pattern between pattern for low profile substrateQUALCOMM INC·Filed 2014·Granted Feb 23, 2016·0 cites·30 claims
- 4252US2019057880A1Integrated circuit package comprising surface capacitor and ground planeQUALCOMM INC·Filed 2018·Application pending·0 cites
- 4351US9151779B2Reconfigurable electric field probeQUALCOMM INC·Filed 2012·Granted Oct 6, 2015·0 cites·36 claims
- 4450US9502491B2Embedded sheet capacitorQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·0 cites·30 claims
- 4550US2022165389A1Personalized meal diet and exercise providing method using integrated health information and service systemNGENEBIO CO LTD·Filed 2021·Application pending·0 cites
- 4649US10109584B2Patterned grounds and methods of forming the sameQUALCOMM INC·Filed 2014·Granted Oct 23, 2018·0 cites·23 claims
- 4749US10049977B2Semiconductor package on package structure and method of forming the sameQUALCOMM INC·Filed 2014·Granted Aug 14, 2018·0 cites·5 claims
- 4849US2016322300A1Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shieldQUALCOMM INC·Filed 2016·Application pending·0 cites
- 4949US2015146340A1Multilayer ceramic capacitor including at least one slotQUALCOMM INC·Filed 2013·Application pending·0 cites
- 5048US11038277B2High impedance surface (HIS) enhanced by discrete passivesBOEING CO·Filed 2019·Granted Jun 15, 2021·0 cites·23 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →