Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield

Abstract

Some novel features pertain to an integrated device package that includes a die, an electromagnetic (EM) passive device, an encapsulation layer covering the die and the EM passive device, and a redistribution portion coupling the die and the EM passive device. In some implementations, the EM passive device includes an electromagnetic (EM) passive device. The EM passive device includes a base layer, a via traversing the base layer, a pad coupled to the via, and at least redistribution layer configured to operate as electromagnetic (EM) passive component, where the redistribution layer is coupled to the pad. The redistribution portion of the EM passive device includes at least one redistribution layer that is configured to electrically couple the die to the EM passive device. The redistribution portion includes at least one redistribution layer that is configured as an electromagnetic (EM) shield.

What is claimed is: 
     
         1 - 20 . (canceled) 
     
     
         21 . A method for fabricating an integrated device package, comprising:
 providing a die;   providing an electromagnetic (EM) passive device;   forming an encapsulation layer around the die and the EM passive device; and   forming a redistribution portion that couples the die and the EM passive device.   
     
     
         22 . The method of  claim 21 , wherein the EM passive device includes an electromagnetic (EM) passive component. 
     
     
         23 . The method of  claim 22 , wherein the EM passive component comprises an inductor, a coupler and/or a transformer. 
     
     
         24 . The method of  claim 21 , wherein providing the EM passive device comprises:
 forming a base layer;   forming a via that traverses the base layer;   forming a pad that couples the via; and   forming at least one redistribution layer configured to operate as an electromagnetic (EM) passive component, wherein the redistribution layer is formed such that the redistribution layer is coupled to the pad.   
     
     
         25 . The method of  claim 21 , wherein forming at least one redistribution portion includes forming at least one redistribution layer that is configured to electrically couple the die to the EM passive device. 
     
     
         26 . The method of  claim 21 , wherein forming at least one redistribution portion includes forming at least one redistribution layer that is configured as an electromagnetic (EM) shield. 
     
     
         27 . The method of  claim 26 , wherein the EM shield is located in the redistribution portion such that the EM shield is at least partially vertically aligned with the EM passive device. 
     
     
         28 . The method of  claim 26 , wherein the EM shield is configured to provide an electrical path for a ground signal. 
     
     
         29 . The method of  claim 26 , wherein the EM shield is configured to be electrically coupled to the EM passive device. 
     
     
         30 . The method of  claim 21 , wherein the integrated device package is incorporated into at least one of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, and/or a laptop computer. 
     
     
         31 . The method of  claim 21 , wherein providing the die comprises coupling an active side of the die to the redistribution portion. 
     
     
         32 . The method of  claim 31 , further comprising coupling a set of solder balls to the redistribution portion. 
     
     
         33 . The method of  claim 21 , wherein providing an electromagnetic (EM) passive device comprises providing the EM passive device such that the EM passive device is substantially aligned with the die along a lateral direction of the integrated device package, and wherein the lateral direction is substantially parallel to a surface, of the redistribution portion, that is coupled to the die.