Inventor · disambiguated record
Dongsoo Moon
Also filed as: MOON DONGSOO
20 granted patents·2 pending applications·131 citations·filing 2007–2013
94Inventor score
Top patents by PatentIndex Score
22 records- 0196US7919871B2Integrated circuit package system for stackable devicesSTATS CHIPPAC LTD·Filed 2008·Granted Apr 5, 2011·47 cites·12 claims
- 0289US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
- 0384US8519536B2Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow processSTATS CHIPPAC LTD·Filed 2012·Granted Aug 27, 2013·5 cites·25 claims
- 0483US8367467B2Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow processSTATS CHIPPAC LTD·Filed 2010·Granted Feb 5, 2013·5 cites·25 claims
- 0581US8609463B2Integrated circuit package system employing multi-package module techniquesKO WONJUN·Filed 2007·Granted Dec 17, 2013·11 cites·18 claims
- 0679US8785251B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Jul 22, 2014·4 cites·25 claims
- 0779US7968373B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2008·Granted Jun 28, 2011·8 cites·20 claims
- 0877US8569895B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2012·Granted Oct 29, 2013·4 cites·18 claims
- 0975US9324659B2Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower dieCHO SUNGWON·Filed 2011·Granted Apr 26, 2016·4 cites·23 claims
- 1074US9228591B2Air conditioner with outdoor unitCHOI SEOK HO·Filed 2011·Granted Jan 5, 2016·4 cites·7 claims
- 1172US7951643B2Integrated circuit packaging system with lead frame and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 1269US8211746B2Integrated circuit packaging system with lead frame and method of manufacture thereofHA JONG-WOO·Filed 2011·Granted Jul 3, 2012·2 cites·20 claims
- 1366US8884339B2Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow processSTATS CHIPPAC LTD·Filed 2013·Granted Nov 11, 2014·1 cites·29 claims
- 1464US9093392B2Integrated circuit packaging system with vertical interconnection and method of manufacture thereofCHO SUNGWON·Filed 2010·Granted Jul 28, 2015·2 cites·20 claims
- 1564US9021829B2Outdoor unit for air conditionerJUNG MIJIN·Filed 2011·Granted May 5, 2015·3 cites·3 claims
- 1661US8513057B2Integrated circuit packaging system with routable underlayer and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Aug 20, 2013·1 cites·20 claims
- 1749US9435547B2Indoor device for an air conditionerLG ELECTRONICS INC·Filed 2013·Granted Sep 6, 2016·0 cites·20 claims
- 1848US9395124B2Indoor device for an air conditionerLG ELECTRONICS INC·Filed 2013·Granted Jul 19, 2016·0 cites·14 claims
- 1946US8193036B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2010·Granted Jun 5, 2012·0 cites·20 claims
- 2045US2010244212A1Integrated circuit packaging system with post type interconnector and method of manufacture thereofHA JONG-WOO·Filed 2009·Application pending·0 cites
- 2139US8692365B2Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereofMOON DONGSOO·Filed 2011·Granted Apr 8, 2014·0 cites·10 claims
- 2233US2012312046A1Air conditioner with a cooling moduleKIM HYUNJONG·Filed 2012·Application pending·0 cites
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