Assignee

MOON DONGSOO

KR·2 granted patents·26 citations·filing 2009–2011

Technology mixH10W2

Top patents by PatentIndex Score

2 records

0189US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
0239US8692365B2Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereofMOON DONGSOO·Filed 2011·Granted Apr 8, 2014·0 cites·10 claims

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