Inventor · disambiguated record
Hyunil Bae
Also filed as: BAE HYUNIL
4 granted patents·2 pending applications·7 citations·filing 2006–2025
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0177US2025391821A1Semiconductor Device and Method of Forming Package with Double-Sided Integrated Passive DeviceSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0267US12424595B2Semiconductor device and method of forming package with double-sided integrated passive deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Sep 23, 2025·0 cites·25 claims
- 0358US9559046B2Semiconductor device and method of forming a fan-in package-on-package structure using through silicon viasBAE HYUNIL·Filed 2008·Granted Jan 31, 2017·4 cites·24 claims
- 0456US8816487B2Integrated circuit packaging system with package-in-package and method of manufacture thereofBAE HYUNIL·Filed 2009·Granted Aug 26, 2014·2 cites·16 claims
- 0555US8476135B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Jul 2, 2013·1 cites·20 claims
- 0639US2007268660A1Spacerless semiconductor package chip stacking systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →