Inventor · disambiguated record
Teck-Gyu Kang
Also filed as: KANG TECK-GYU
45 granted patents·8 pending applications·1,857 citations·filing 1997–2023
98Inventor score
Top patents by PatentIndex Score
53 records- 0199US8728865B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted May 20, 2014·88 cites·16 claims
- 0299US8093697B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2010·Granted Jan 10, 2012·117 cites·16 claims
- 0399US8058101B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2005·Granted Nov 15, 2011·87 cites·16 claims
- 0498US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 0598US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 0698US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 0798US8329581B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted Dec 11, 2012·45 cites·17 claims
- 0898US7495179B2Components with posts and padsTESSERA INC·Filed 2005·Granted Feb 24, 2009·70 cites·14 claims
- 0998US7453157B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted Nov 18, 2008·101 cites·36 claims
- 1098US7176506B2High frequency chip packages with connecting elementsTESSERA INC·Filed 2003·Granted Feb 13, 2007·320 cites·18 claims
- 1197US11830845B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Nov 28, 2023·4 cites·19 claims
- 1297US7659617B2Substrate for a flexible microelectronic assembly and a method of fabricating thereofTESSERA INC·Filed 2006·Granted Feb 9, 2010·49 cites·23 claims
- 1396US10032695B2Powermap optimized thermally aware 3D chip packageGOOGLE INC·Filed 2016·Granted Jul 24, 2018·22 cites·21 claims
- 1496US7071547B2Assemblies having stacked semiconductor chips and methods of making sameTESSERA INC·Filed 2003·Granted Jul 4, 2006·121 cites·17 claims
- 1595US7745943B2Microelectonic packages and methods thereforTESSERA INC·Filed 2007·Granted Jun 29, 2010·32 cites·29 claims
- 1694US7368695B2Image sensor package and fabrication methodTESSERA INC·Filed 2005·Granted May 6, 2008·50 cites·21 claims
- 1794US7246431B2Methods of making microelectronic packages including folded substratesTESSERA INC·Filed 2003·Granted Jul 24, 2007·101 cites·27 claims
- 1893US8125066B1Package on package configurations with embedded solder balls and interposal layerKANG TECK-GYU·Filed 2009·Granted Feb 28, 2012·31 cites·17 claims
- 1993US7709968B2Micro pin grid array with pin motion isolationTESSERA INC·Filed 2004·Granted May 4, 2010·65 cites·24 claims
- 2092US9137903B2Semiconductor chip assembly and method for making sameKANG TECK-GYU·Filed 2011·Granted Sep 15, 2015·13 cites·20 claims
- 2192US7268426B2High-frequency chip packagesTESSERA INC·Filed 2004·Granted Sep 11, 2007·56 cites·18 claims
- 2292US7053485B2Microelectronic packages with self-aligning featuresTESSERA INC·Filed 2003·Granted May 30, 2006·76 cites·10 claims
- 2391US10062661B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2017·Granted Aug 28, 2018·5 cites·14 claims
- 2489US8641913B2Fine pitch microcontacts and method for forming thereofHABA BELGACEM·Filed 2007·Granted Feb 4, 2014·17 cites·25 claims
- 2589US8415809B2Flip chip overmold packageKANG TECK-GYU·Filed 2008·Granted Apr 9, 2013·16 cites·17 claims
- 2685US11424211B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA LLC·Filed 2020·Granted Aug 23, 2022·1 cites·29 claims
- 2784US7999397B2Microelectronic packages and methods thereforTESSERA INC·Filed 2010·Granted Aug 16, 2011·5 cites·17 claims
- 2884US7397068B2Solid state lighting deviceTESSERA INC·Filed 2004·Granted Jul 8, 2008·37 cites·15 claims
- 2980US9218988B2Microelectronic packages and methods thereforTESSERA INC·Filed 2014·Granted Dec 22, 2015·3 cites·17 claims
- 3080US8604348B2Method of making a connection component with posts and padsKUBOTA YOICHI·Filed 2011·Granted Dec 10, 2013·4 cites·27 claims
- 3178US8046912B2Method of making a connection component with posts and padsTESSERA INC·Filed 2009·Granted Nov 1, 2011·5 cites·15 claims
- 3278US7883937B1Electronic package and method of forming the sameALTERA CORP·Filed 2007·Granted Feb 8, 2011·7 cites·11 claims
- 3377US10593643B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2018·Granted Mar 17, 2020·1 cites·14 claims
- 3472US12494453B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Dec 9, 2025·0 cites·16 claims
- 3572US10833044B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 3671US9054023B1Flip chip overmold packageALTERA CORP·Filed 2013·Granted Jun 9, 2015·2 cites·20 claims
- 3770US9691731B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 3863US8531039B2Micro pin grid array with pin motion isolationDAMBERG PHILIP·Filed 2010·Granted Sep 10, 2013·2 cites·31 claims
- 3961US8710643B2Electronic package with fluid flow barriersKANG TECK-GYU·Filed 2011·Granted Apr 29, 2014·1 cites·16 claims
- 4059US2014145329A1Fine pitch microcontacts and method for forming thereofTESSERA INC·Filed 2014·Application pending·0 cites
- 4155US9984901B2Method for making a microelectronic assembly having conductive elementsTESSERA INC·Filed 2015·Granted May 29, 2018·0 cites·19 claims
- 4253US7304376B2Microelectronic assemblies with springsTESSERA INC·Filed 2004·Granted Dec 4, 2007·4 cites·30 claims
- 4352US9716075B2Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2015·Granted Jul 25, 2017·0 cites·11 claims
- 4452US2017309593A1Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2017·Application pending·0 cites
- 4551US8378487B2Wafer level chip package and a method of fabricating thereofTESSERA INC·Filed 2012·Granted Feb 19, 2013·0 cites·5 claims
- 4651US2007096160A1High frequency chip packages with connecting elementsTESSERA INC·Filed 2006·Application pending·0 cites
- 4749US8133808B2Wafer level chip package and a method of fabricating thereofKANG TECK-GYU·Filed 2006·Granted Mar 13, 2012·0 cites·19 claims
- 4844US2008185705A1Microelectronic packages and methods thereforTESSERA INC·Filed 2007·Application pending·0 cites
- 4942US2007152310A1Electrical ground method for ball stack packageTESSERA INC·Filed 2005·Application pending·0 cites
- 5041US2006223227A1Molding method for foldover packageTESSERA INC·Filed 2005·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →