Inventor · disambiguated record
Mitsutaka Sato
Also filed as: SATO MITSUTAKA
52 granted patents·5 pending applications·2,960 citations·filing 1992–2020
99Inventor score
Files withFUJITSU LTD41KANEKA CORP6SATO MITSUTAKA3FUJITSU MICROELECTRONICS LTD1FUJITSU SEMICONDUCTOR LTD1
Top patents by PatentIndex Score
57 records- 0198US6476503B1Semiconductor device having columnar electrode and method of manufacturing sameFUJITSU LTD·Filed 2000·Granted Nov 5, 2002·266 cites·11 claims
- 0297US6316838B1Semiconductor deviceFUJITSU LTD·Filed 2000·Granted Nov 13, 2001·571 cites·8 claims
- 0395US7084513B2Semiconductor device having a plurality of semiconductor chips and method for manufacturing the sameFUJITSU LTD·Filed 2004·Granted Aug 1, 2006·91 cites·14 claims
- 0495US6548898B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Apr 15, 2003·98 cites·28 claims
- 0594US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0694US6348728B1Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layerFUJITSU LTD·Filed 2000·Granted Feb 19, 2002·91 cites·9 claims
- 0794US6060768ASemiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frameFUJITSU LTD·Filed 1997·Granted May 9, 2000·192 cites·12 claims
- 0893US5801439ASemiconductor device and semiconductor device unit for a stack arrangementFUJITSU LTD·Filed 1997·Granted Sep 1, 1998·168 cites·20 claims
- 0992US5519251ASemiconductor device and method of producing the sameFUJITSU LTD·Filed 1993·Granted May 21, 1996·123 cites·18 claims
- 1092US5508565ASemiconductor device having a plurality of chips having identical circuit arrangement sealed in packageFUJITSU LTD·Filed 1994·Granted Apr 16, 1996·150 cites·35 claims
- 1191US7064645B2Electronic deviceFUJITSU LTD·Filed 2002·Granted Jun 20, 2006·46 cites·10 claims
- 1290US6836025B2Semiconductor device configured to be surface mountableFUJITSU LTD·Filed 2003·Granted Dec 28, 2004·61 cites·16 claims
- 1388US6781224B2Semiconductor device and package including forming pyramid mount protruding through silicon substrateFUJITSU LTD·Filed 2002·Granted Aug 24, 2004·42 cites·12 claims
- 1487US6288444B1Semiconductor device and method of producing the sameFUJITSU LTD·Filed 1999·Granted Sep 11, 2001·80 cites·24 claims
- 1586US6909181B2Light signal processing systemFUJITSU LTD·Filed 2002·Granted Jun 21, 2005·34 cites·15 claims
- 1686US6333564B1Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodesFUJITSU LTD·Filed 1999·Granted Dec 25, 2001·87 cites·14 claims
- 1783US6784543B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·30 cites·35 claims
- 1883US5637915ASemiconductor device affixed to an upper and a lower leadframeFUJITSU LTD·Filed 1996·Granted Jun 10, 1997·69 cites·14 claims
- 1982US7759246B2Semiconductor device having a plurality of semiconductor chips and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jul 20, 2010·9 cites·8 claims
- 2082US6586273B2Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminalFUJITSU LTD·Filed 2001·Granted Jul 1, 2003·28 cites·8 claims
- 2182US5760471ASemiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic packageFUJITSU LTD·Filed 1997·Granted Jun 2, 1998·71 cites·12 claims
- 2281US6462424B1Semiconductor device, method of producing semiconductor device and semiconductor device mounting structureFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·28 cites·6 claims
- 2381US5842628AWire bonding method, semiconductor device, capillary for wire bonding and ball bump forming methodFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·56 cites·8 claims
- 2480US5409866AProcess for manufacturing a semiconductor device affixed to an upper and a lower leadframeFUJITSU LTD·Filed 1992·Granted Apr 25, 1995·60 cites·24 claims
- 2577US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 2674US8178619B2(Meth) acrylic polymer and vinyl chloride resin composition containing the sameSATO MITSUTAKA·Filed 2006·Granted May 15, 2012·3 cites·8 claims
- 2774US6495773B1Wire bonded device with ball-shaped bondsFUJITSU LTD·Filed 1998·Granted Dec 17, 2002·38 cites·4 claims
- 2874US5786985ASemiconductor device and semiconductor device unitFUJITSU LTD·Filed 1996·Granted Jul 28, 1998·47 cites·22 claims
- 2968US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 3068US6165819ASemiconductor device, method of producing semiconductor device and semiconductor device mounting structureFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·30 cites·9 claims
- 3165US11898016B2Master batch, polycarbonate resin composition, injection foam molded body and method for producing sameKANEKA CORP·Filed 2020·Granted Feb 13, 2024·0 cites·18 claims
- 3265US8097954B2Adhesive layer forming a capacitor dielectric between semiconductor chipsOZAWA KANAME·Filed 2006·Granted Jan 17, 2012·5 cites·6 claims
- 3363US7692294B2Semiconductor device and method for fabricating the sameFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Apr 6, 2010·2 cites·11 claims
- 3463US6905951B2Method of forming a device substrate and semiconductor package including a pyramid contactFUJITSU LTD·Filed 2004·Granted Jun 14, 2005·9 cites·6 claims
- 3563US6723762B1Foamable vinyl chloride-base resin compositionsKANEKA CORP·Filed 2000·Granted Apr 20, 2004·7 cites·3 claims
- 3661US6967399B2Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminalFUJITSU LTD·Filed 2003·Granted Nov 22, 2005·8 cites·4 claims
- 3757US7251801B2Method of designing circuit boardFUJITSU LTD·Filed 2004·Granted Jul 31, 2007·6 cites·7 claims
- 3857US5446317ASingle in-line package for surface mountingFUJITSU LTD·Filed 1993·Granted Aug 29, 1995·22 cites·10 claims
- 3957US2007197728A1Processing aid and vinyl chloride resin composition containing the sameKANEKA CORP·Filed 2007·Application pending·0 cites
- 4056US6094356ASemiconductor device and semiconductor device moduleFUJITSU LTD·Filed 1998·Granted Jul 25, 2000·21 cites·4 claims
- 4155US6627479B2Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layerFUJITSU LTD·Filed 2001·Granted Sep 30, 2003·5 cites·3 claims
- 4252US6459161B1Semiconductor device with connection terminals in the form of a grid arrayNEC CORP·Filed 1999·Granted Oct 1, 2002·17 cites·14 claims
- 4351US6084309ASemiconductor device and semiconductor device mounting structureFUJITSU LTD·Filed 1997·Granted Jul 4, 2000·20 cites·19 claims
- 4449US8564975B2AC-DC converterSATO MAKOTO·Filed 2008·Granted Oct 22, 2013·2 cites·4 claims
- 4547US2009227734A1Thermoplastic Resin CompositionKANEKA CORP·Filed 2007·Application pending·0 cites
- 4645US5773313ASemiconductor device and method of producing the sameFUJITSU LTD·Filed 1995·Granted Jun 30, 1998·10 cites·5 claims
- 4745US5728601AProcess for manufacturing a single in-line package for surface mountingFUJITSU LTD·Filed 1995·Granted Mar 17, 1998·11 cites·12 claims
- 4843US2007138616A1Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 4943US2004171741A1Processability improver and vinyl chloride resin composition containing the sameFiled 2002·Application pending·0 cites
- 5040US6610757B2Foamable vinyl chloride resin compositionKANEKA CORP·Filed 2001·Granted Aug 26, 2003·0 cites·6 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →