Inventor · disambiguated record
Christopher Wade
Also filed as: WADE CHRISTOPHER · WADE CHRISTOPHER P · WADE CHRISTOPHER PAUL
8 granted patents·6 pending applications·245 citations·filing 2000–2024
87Inventor score
Files withTESSERA INC4APPLIED MATERIALS INC3AVAGO TECH INT SALES PTE LID2AVAGO TECHNOLOGIES GENERAL IP1FAZZIO R SHANE1
Top patents by PatentIndex Score
14 records- 0195US6440495B1Chemical vapor deposition of ruthenium films for metal electrode applicationsAPPLIED MATERIALS INC·Filed 2000·Granted Aug 27, 2002·136 cites·12 claims
- 0294US7569424B2Method of forming a wall structure in a microelectronic assemblyTESSERA INC·Filed 2006·Granted Aug 4, 2009·28 cites·18 claims
- 0391US6479100B2CVD ruthenium seed for CVD ruthenium depositionAPPLIED MATERIALS INC·Filed 2001·Granted Nov 12, 2002·61 cites·53 claims
- 0486US7479685B2Electronic device on substrate with cavity and mitigated parasitic leakage pathAVAGO TECHNOLOGIES GENERAL IP·Filed 2006·Granted Jan 20, 2009·13 cites·7 claims
- 0573US8299626B2Microelectronic packageMOHAMMED ILYAS·Filed 2007·Granted Oct 30, 2012·5 cites·4 claims
- 0662US2025385153A1Thermal management systems and methods for semiconductor devicesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 0759US12412834B2Triple-sided moduleAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Sep 9, 2025·0 cites·15 claims
- 0853US8080854B2Electronic device on substrate with cavity and mitigated parasitic leakage pathFAZZIO R SHANE·Filed 2008·Granted Dec 20, 2011·2 cites·8 claims
- 0951US2010044860A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerTESSERA INTERCONNECT MATERIALS·Filed 2009·Application pending·0 cites
- 1049US9349672B2Microelectronic packageTESSERA INC·Filed 2012·Granted May 24, 2016·0 cites·21 claims
- 1149US2013186944A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerINVENSAS CORP·Filed 2013·Application pending·0 cites
- 1249US2009071707A1Multilayer substrate with interconnection vias and method of manufacturing the sameTESSERA INC·Filed 2008·Application pending·0 cites
- 1344US2003129306A1Chemical vapor deposition of ruthenium films for metal electrode applicationsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1439US2008156518A1Alignment and cutting of microelectronic substratesTESSERA INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →