Inventor · disambiguated record
Takashi Nihonmatsu
Also filed as: NIHONMATSU TAKASHI
7 granted patents·1 pending application·107 citations·filing 1977–2002
86Inventor score
Top patents by PatentIndex Score
8 records- 0188US4168437AOptoelectric multi-sensor measuring apparatus and a method for measuring surface flatness therewithNAGANO ELECTRONICS IND·Filed 1977·Granted Sep 18, 1979·47 cites·4 claims
- 0278US6346485B1Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2000·Granted Feb 12, 2002·16 cites·2 claims
- 0372US6432837B2Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2001·Granted Aug 13, 2002·11 cites·6 claims
- 0461US7332437B2Method for processing semiconductor wafer and semiconductor waferSHINETSU HANDOTAI KK·Filed 2001·Granted Feb 19, 2008·9 cites·27 claims
- 0559US6239039B1Semiconductor wafers processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·17 cites·11 claims
- 0645US6764392B2Wafer polishing method and wafer polishing deviceSHINETSU HANDOTAI KK·Filed 2000·Granted Jul 20, 2004·1 cites·29 claims
- 0735US2004072437A1Production method for silicon wafer and silicon wafer and soi waferFiled 2002·Application pending·0 cites
- 0832US6080641AMethod of manufacturing semiconductor waferSHINETSU HANDOTAI KK·Filed 1997·Granted Jun 27, 2000·6 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →