Inventor · disambiguated record
Thomas H. Templeton, Jr.
Also filed as: TEMPLETON JR THOMAS H · TEMPLETON JR THOMAS HENRY · TEMPLETON THOMAS B · TEMPLETON THOMAS H
18 granted patents·2 pending applications·746 citations·filing 1992–2004
96Inventor score
Top patents by PatentIndex Score
20 records- 0192USRE36907ELeadframe with power and ground planesINTEGRATED DEVICE TECH·Filed 1997·Granted Oct 10, 2000·121 cites·47 claims
- 0292US5457340ALeadframe with power and ground planesINTEGRATED DEVICE TECH·Filed 1992·Granted Oct 10, 1995·118 cites·47 claims
- 0385US5448165AElectrically tested and burned-in semiconductor die and method for producing sameINTEGRATED DEVICE TECH·Filed 1993·Granted Sep 5, 1995·88 cites·19 claims
- 0483US5682296APlastic integrated circuit card with reinforcement structure located over integrated circuit module for protecting sameUS3 INC·Filed 1996·Granted Oct 28, 1997·35 cites·5 claims
- 0581US6239976B1Reinforced micromoduleCOMSENSE TECHNOLOGIES LTD·Filed 1998·Granted May 29, 2001·71 cites·45 claims
- 0680US5519201AElectrical interconnection for structure including electronic and/or electromagnetic devicesUS3 INC·Filed 1994·Granted May 21, 1996·66 cites·12 claims
- 0778US5679975AConductive encapsulating shield for an integrated circuitINTEGRATED DEVICE TECH·Filed 1995·Granted Oct 21, 1997·56 cites·13 claims
- 0878US5673179APlastic integrated circuit card with reinforcement structure outer to the card and protecting integrated circuit moduleUS3 INC·Filed 1996·Granted Sep 30, 1997·27 cites·6 claims
- 0977US5581445APlastic integrated circuit card with reinforcement structure for protecting integrated circuit moduleUS3 INC·Filed 1994·Granted Dec 3, 1996·35 cites·11 claims
- 1072US5874321APackage integrated circuit having thermal enhancement and reduced footprint sizeINTEGRATED DEVICE TECH·Filed 1997·Granted Feb 23, 1999·37 cites·9 claims
- 1170US5682294AIntegrated circuit card with a reinforcement structure for retaining and protecting integrated circuit moduleUS3 INC·Filed 1996·Granted Oct 28, 1997·19 cites·9 claims
- 1262US6946744B2System and method of reducing die attach stress and strainPOWER ONE LTD·Filed 2003·Granted Sep 20, 2005·11 cites·39 claims
- 1359US6058017APlastic integrated circuit card with an enclosed reinforcement structure separated from an integrated circuit module for protecting the integrated circuit moduleUS3 INC·Filed 1996·Granted May 2, 2000·14 cites·13 claims
- 1457US7027305B2Arrangement for surface mounting of subassemblies on a mother boardPOWER ONE INC·Filed 2003·Granted Apr 11, 2006·10 cites·10 claims
- 1557US5766975APackaged integrated circuit having thermal enhancement and reduced footprint sizeINTEGRATED DEVICE TECH·Filed 1995·Granted Jun 16, 1998·21 cites·14 claims
- 1652US5682295APlastic integrated circuit card with reinforcement structure separated from integrated circuit module by cardUS3 INC·Filed 1996·Granted Oct 28, 1997·9 cites·7 claims
- 1750US7145085B2Enhanced connection arrangement for co-planar vertical surface mounting of subassemblies on a mother boardPOWER ONE INC·Filed 2004·Granted Dec 5, 2006·3 cites·6 claims
- 1841US5682293AIntegrated circuit card having a reinforcement structure and an integrated circuit module disposed on opposing surfacesUS3 INC·Filed 1996·Granted Oct 28, 1997·5 cites·11 claims
- 1941US2001055202A1Reinforced micromoduleFiled 2001·Application pending·0 cites
- 2037US2005161806A1Area array packages with overmolded pin-fin heat sinksFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →