Reinforced micromodule

Abstract

A reinforcement structure to protect an integrated circuit module located within a card-type data carrier or smart card. The reinforcement structure is rigid, having a modulus of elasticity higher than modulus of elasticity of the smart card, and has a thickness dimension that is co-extensive with the thickness dimension of the smart card. The reinforcement structure is provided with a cavity for housing the integrated circuit module. In a preferred embodiment, the reinforcement structure is constructed of thermally and electrically conductive material that is castable or formable to facilitate integration of additional electronic circuit elements therein. In another embodiment, the reinforcement structure is configured in the shape of a SIMM card and is used in place of the normally flexible plastic SIMM card body.

What is claimed is:  
     
         1 . A reinforced card-type data carrier, comprising: 
 a) a semi-rigid card body having a first modulus of elasticity, a first thickness dimension and at least one through-hole provided in said thickness dimension;    b) a reinforcement structure having an upper surface and a perimeter edge secured within said at least one through-hole, wherein said reinforcement structure includes: 
 i) a second modulus of elasticity, said second modulus of elasticity being higher than said first modulus of elasticity;  
 ii) a second thickness dimension, said second thickness dimension being co-extensive with said first thickness dimension;  
 iii) a cavity provided in said upper surface; and  
   c) a micromodule having an electronic component, said micromodule being housed within said cavity.    
     
     
         2 . The reinforced card-type data carrier according to    claim 1   , wherein said reinforcement structure comprises electrically and thermally conductive material.  
     
     
         3 . The reinforced card-type data carrier according to    claim 2   , wherein at least one additional circuit element is contained within said reinforcement structure.  
     
     
         4 . The reinforced card-type data carrier according to    claim 1   , wherein said reinforcement structure comprises a molding compound.  
     
     
         5 . The reinforced card-type data carrier according to    claim 4   , wherein at least one additional circuit element is contained within said reinforcement structure.  
     
     
         6 . The reinforced card-type data carrier according to    claim 2   , wherein said reinforcement structure further comprises a metal.  
     
     
         7 . The reinforced card-type data carrier according to    claim 2   , wherein said reinforcement structure farther comprises metal fiber resin material.  
     
     
         8 . The reinforced card-type data carrier according to    claim 2   , wherein said reinforcement structure further comprises a molding compound.  
     
     
         9 . The reinforced card-type data carrier according to    claim 1   , wherein said micromodule has contacts which are exposed at said upper surface of said reinforcement structure.  
     
     
         10 . The reinforced card-type data carrier according to    claim 1   , wherein said micromodule is secured within said cavity by an adhesive having sufficient elasticity to absorb flex and force moments subjected to the data carrier during typical usage.  
     
     
         11 . A reinforced micromodule adapted for use in combination with card-type data carriers, comprising: 
 a) a rigid, generally card-shaped reinforcement structure comprising electrically and thermally conductive material, said reinforcement structure having a thickness dimension, an upper surface, and a cavity provided in said upper surface; and    b) a micromodule having an electronic component, said micromodule being housed within said cavity; and    c) bonding means for securing said micromodule within said cavity.    
     
     
         12 . The reinforced micromodule according to    claim 11   , wherein at least one additional circuit element is contained within said reinforcement structure.  
     
     
         13 . The reinforced micromodule according to    claim 11   , wherein said reinforcement structure comprises a molding compound.  
     
     
         14 . The reinforced micromodule according to    claim 13   , wherein at least one additional circuit element is contained within said reinforcement structure.  
     
     
         15 . The reinforced micromodule according to    claim 11   , wherein said reinforcement structure further comprises a metal.  
     
     
         16 . The reinforced micromodule according to    claim 11   , wherein said reinforcement structure further comprises metal fiber resin material.  
     
     
         17 . The reinforced micromodule according to    claim 11   , wherein said reinforcement structure further comprises a molding compound.  
     
     
         18 . The reinforced micromodule according to    claim 11   , wherein said micromodule has contacts which are exposed at said upper surface of said reinforcement structure.  
     
     
         19 . The reinforced micromodule according to    claim 11   , wherein said bonding means comprises an adhesive having sufficient elasticity to absorb flex and force moments subjected to the data carrier during typical usage.  
     
     
         20 . The reinforced micromodule according to    claim 19   , wherein said adhesive comprises a room temperature vulcanizing silicone rubber compound