Inventor · disambiguated record
Boon Meng Chan
Also filed as: CHAN BOON M · CHAN BOON MENG
4 granted patents·1 pending application·38 citations·filing 1992–2008
75Inventor score
Top patents by PatentIndex Score
5 records- 0158US5698242AApparatus for the injection molding of semiconductor elementsGEN INSTRUMENT CORP·Filed 1995·Granted Dec 16, 1997·19 cites·5 claims
- 0251US7741161B2Method of making integrated circuit package with transparent encapsulantCARSEM M SDN BHD·Filed 2008·Granted Jun 22, 2010·2 cites·11 claims
- 0335US6068809AMethod of injection molding elements such as semiconductor elementsGEN SEMICONDUCTOR INC·Filed 1997·Granted May 30, 2000·6 cites·4 claims
- 0431US5301720AMethod for use in the manufacture of semiconductor devices and apparatus for use in connection with the methodKRAS ASIA LTD·Filed 1992·Granted Apr 12, 1994·11 cites·8 claims
- 0522US2005146057A1Micro lead frame package having transparent encapsulantFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →