Micro lead frame package having transparent encapsulant

Abstract

The present invention discloses an MLP having an optically transparent encapsulant. The MLP comprises a lead frame having a die-pad, a plurality of lead fingers and an interlock undercut. A die is placed onto the die-pad. A conductive wire is provided for connecting the die to the plurality of lead finger. The package is then encapsulated using optically transparent encapsulant.

1 . A Micro Lead Frame Package, comprising: 
 a lead frame having a die-pad, a plurality of lead fingers and an interlock undercut;    a die placed onto said die-pad;    conductive wire connecting said die to said plurality of lead finger; and    an encapsulant,    characterised by    said encapsulant being optically transparent.    
     
     
         2 . A Micro Lead Frame Package as claimed in  claim 1 , further characterised by said encapsulant being applied to one side of said lead frame.  
     
     
         3 . A Micro Lead Frame Package as claimed in  claim 2 , further characterised by said encapsulant flowing into said interlock undercut to form a locking means.  
     
     
         4 . A Lead Frame body for fabrication of micro lead frame package, comprising: 
 a plurality of a lead frame each having a die-pad, a plurality of lead fingers and an interlock undercut;    characterised by    said plurality of lead frame being arranged in a matrix-array.    
     
     
         5 . A Lead Frame body as claimed in  claim 4 , further characterised by said lead frame being provided with a stress-relief means.  
     
     
         6 . A Lead Frame body as claimed in  claim 4 , further characterised by said stress-relief means being slots.