Inventor · disambiguated record
John Floyd Ostrowski
Also filed as: OSTROWSKI JOHN · OSTROWSKI JOHN F · OSTROWSKI JOHN FLOYD
10 granted patents·4 pending applications·176 citations·filing 1999–2021
87Inventor score
Top patents by PatentIndex Score
14 records- 0196US10066311B2Multi-contact lipseals and associated electroplating methodsLAM RES CORP·Filed 2016·Granted Sep 4, 2018·9 cites·19 claims
- 0293US10208395B2Bubble and foam solutions using a completely immersed air-free feedback flow control valveLAM RES CORP·Filed 2017·Granted Feb 19, 2019·3 cites·13 claims
- 0392US6440291B1Controlled induction by use of power supply trigger in electrochemical processingNOVELLUS SYSTEMS INC·Filed 2000·Granted Aug 27, 2002·37 cites·19 claims
- 0489US6167893B1Dynamic chuck for semiconductor wafer or other substrateNOVELLUS SYSTEMS INC·Filed 1999·Granted Jan 2, 2001·113 cites·7 claims
- 0588US9617652B2Bubble and foam solutions using a completely immersed air-free feedback flow control valveLAM RES CORP·Filed 2013·Granted Apr 11, 2017·3 cites·18 claims
- 0684US8753447B2Heat shield for heater in semiconductor processing apparatusLIND GARY·Filed 2009·Granted Jun 17, 2014·11 cites·4 claims
- 0770US11746435B2Removing bubbles from plating cellsLAM RES CORP·Filed 2021·Granted Sep 5, 2023·0 cites·39 claims
- 0870US10655240B2Removing bubbles from plating cellsLAM RES CORP·Filed 2018·Granted May 19, 2020·0 cites·37 claims
- 0967US2018363162A1Multi-contact lipseals and associated electroplating methodsLAM RES CORP·Filed 2018·Application pending·0 cites
- 1064US11214887B2Removing bubbles from plating cellLAM RES CORP·Filed 2020·Granted Jan 4, 2022·0 cites·38 claims
- 1158US8346611B2Systems and methods for pre-paid futures procurementFIRST DATA CORP·Filed 2009·Granted Jan 1, 2013·0 cites·17 claims
- 1255US2023175161A1Blended contact fingers for preventing cracks during thin substrate handlingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1355US2009260571A1Showerhead for chemical vapor depositionNOVELLUS SYSTEMS INC·Filed 2008·Application pending·0 cites
- 1440US2022220627A1Substrate sticking and breakage mitigationLAM RES CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →