Inventor · disambiguated record
A. Farid Issaq
Also filed as: ISSAQ A FARID
7 granted patents·2 pending applications·654 citations·filing 2002–2008
89Inventor score
Top patents by PatentIndex Score
9 records- 0198US7459763B1Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse materialACTEL CORP·Filed 2004·Granted Dec 2, 2008·267 cites·33 claims
- 0298US7393722B1Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse materialACTEL CORP·Filed 2005·Granted Jul 1, 2008·269 cites·5 claims
- 0393US7929345B2Push-pull memory cell configured for simultaneous programming of n-channel and p-channel non-volatile transistorsACTEL CORP·Filed 2008·Granted Apr 19, 2011·42 cites·12 claims
- 0492US7390726B1Switching ratio and on-state resistance of an antifuse programmed below 5 mA and having a Ta or TaN barrier metal layerACTEL CORP·Filed 2005·Granted Jun 24, 2008·29 cites·27 claims
- 0581US7358589B1Amorphous carbon metal-to-metal antifuse with adhesion promoting layersACTEL CORP·Filed 2005·Granted Apr 15, 2008·9 cites·22 claims
- 0677US6728126B1Programming methods for an amorphous carbon metal-to-metal antifuseACTEL CORP·Filed 2002·Granted Apr 27, 2004·24 cites·9 claims
- 0770US6965156B1Amorphous carbon metal-to-metal antifuse with adhesion promoting layersUNIV TEXAS TECH SYSTEM·Filed 2002·Granted Nov 15, 2005·14 cites·34 claims
- 0853US2009057821A1Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse materialACTEL CORP·Filed 2008·Application pending·0 cites
- 0950US2008197450A1Amorphous carbon metal-to-metal antifuse with adhesion promoting layersACTEL CORP·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →