Inventor · disambiguated record
Alex P. Pamatat
Also filed as: PAMATAT ALEX P
10 granted patents·80 citations·filing 2005–2013
88Inventor score
Top patents by PatentIndex Score
10 records- 0192US7179151B1Polishing pad, a polishing apparatus, and a process for using the polishing padFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 20, 2007·25 cites·20 claims
- 0285US8592926B2Substrate bonding with metal germanium silicon materialMONTEZ RUBEN B·Filed 2011·Granted Nov 26, 2013·8 cites·22 claims
- 0385US7534162B2Grooved platen with channels or pathway to ambient airFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 19, 2009·13 cites·13 claims
- 0483US8058143B2Substrate bonding with metal germanium silicon materialMONTEZ RUBEN B·Filed 2009·Granted Nov 15, 2011·11 cites·24 claims
- 0583US7074118B1Polishing carrier head with a modified pressure profileFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 11, 2006·12 cites·20 claims
- 0672US7520797B2Platen endpoint window with pressure reliefFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 21, 2009·5 cites·20 claims
- 0766US8551814B2Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processingKARLIN LISA H·Filed 2010·Granted Oct 8, 2013·2 cites·13 claims
- 0866US7497763B2Polishing pad, a polishing apparatus, and a process for using the polishing padFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Mar 3, 2009·3 cites·20 claims
- 0957US7892070B2Process of using a polishing apparatus including a platen window and a polishing padFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Feb 22, 2011·1 cites·18 claims
- 1050US9061885B2Cavity based packaging for MEMS devicesKARLIN LISA H·Filed 2013·Granted Jun 23, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →