Assignee
KARLIN LISA H
US·7 granted patents·1 pending application·7 citations·filing 2010–2014
Top patents by PatentIndex Score
8 records- 0167US8921203B2Method of forming an integrated circuit having varying substrate depthKARLIN LISA H·Filed 2013·Granted Dec 30, 2014·2 cites·17 claims
- 0267US8525316B2Eutectic flow containment in a semiconductor fabrication processKARLIN LISA H·Filed 2010·Granted Sep 3, 2013·2 cites·16 claims
- 0366US8551814B2Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processingKARLIN LISA H·Filed 2010·Granted Oct 8, 2013·2 cites·13 claims
- 0465US8652865B2Attaching a MEMS to a bonding waferKARLIN LISA H·Filed 2011·Granted Feb 18, 2014·1 cites·5 claims
- 0553US9233836B2Semiconductor device including accelerometer devicesKARLIN LISA H·Filed 2014·Granted Jan 12, 2016·0 cites·20 claims
- 0650US9061885B2Cavity based packaging for MEMS devicesKARLIN LISA H·Filed 2013·Granted Jun 23, 2015·0 cites·8 claims
- 0735US8455286B2Method of making a micro-electro-mechanical-systems (MEMS) deviceKARLIN LISA H·Filed 2010·Granted Jun 4, 2013·0 cites·13 claims
- 0835US2012107992A1Method of producing layered wafer structure having anti-stiction bumpsKARLIN LISA H·Filed 2010·Application pending·0 cites
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