Inventor · disambiguated record
Todd P. Albertson
Also filed as: ALBERTSON TODD · ALBERTSON TODD P
24 granted patents·6 pending applications·145 citations·filing 2000–2022
94Inventor score
Files withINTEL CORP12HIGH SPEED INTERCONNECTS LLC6SHIA DAVID3ALBERTSON TODD P2MICRON TECHNOLOGY INC2
Top patents by PatentIndex Score
30 records- 0193US8962482B2Multi-layer interconnect with isolation layerALBERTSON TODD·Filed 2006·Granted Feb 24, 2015·64 cites·10 claims
- 0286US8891235B2Thermal interface for multi-chip packagesWALCZYK JOSEPH F·Filed 2012·Granted Nov 18, 2014·13 cites·30 claims
- 0384US8710858B2Micro positioning test socket and methods for active precision alignment and co-planarity feedbackDETOFSKY ABRAM M·Filed 2010·Granted Apr 29, 2014·7 cites·14 claims
- 0480US10096953B1Methods and apparatus for shielded and grounded cable systemHIGH SPEED INTERCONNECTS LLC·Filed 2017·Granted Oct 9, 2018·8 cites·21 claims
- 0580US9823273B2Probe tip formation for die sort and testINTEL CORP·Filed 2013·Granted Nov 21, 2017·6 cites·21 claims
- 0679US7345495B2Temperature and voltage controlled integrated circuit processesINTEL CORP·Filed 2004·Granted Mar 18, 2008·29 cites·41 claims
- 0775US9255945B2Micro positioning test socket and methods for active precision alignment and co-planarity feedbackINTEL CORP·Filed 2014·Granted Feb 9, 2016·2 cites·6 claims
- 0872US10939545B2Methods and apparatus for flex circuit and cable attachment systemHIGH SPEED INTERCONNECTS LLC·Filed 2020·Granted Mar 2, 2021·1 cites·16 claims
- 0968US9279854B2Mechanism for facilitating modular processing cell framework and application for asynchronous parallel singulated semiconductor device handling and testingJOHNSON JOHN C·Filed 2012·Granted Mar 8, 2016·2 cites·20 claims
- 1067US9977054B2Etching for probe wire tips for microelectronic device testINTEL CORP·Filed 2015·Granted May 22, 2018·1 cites·21 claims
- 1165US11340258B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1264US9069014B2Wire probe assembly and forming process for die testingALBERTSON TODD P·Filed 2012·Granted Jun 30, 2015·2 cites·17 claims
- 1363US7642651B2Multi-layer interconnect with isolation layerMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 5, 2010·2 cites·21 claims
- 1462US9354273B2Composite wire probe test assemblyINTEL CORP·Filed 2012·Granted May 31, 2016·1 cites·11 claims
- 1561US9134343B2Sort probe gripperSHIA DAVID·Filed 2012·Granted Sep 15, 2015·1 cites·18 claims
- 1660US2021153344A1Methods and Apparatus for Flex Circuit and Cable Attachment SystemHIGH SPEED INTERCONNECTS LLC·Filed 2021·Application pending·0 cites
- 1754US11552432B2Methods and apparatus for RF shield and cable attachment systemHIGH SPEED INTERCONNECTS LLC·Filed 2020·Granted Jan 10, 2023·0 cites·19 claims
- 1854US10598696B2Probe pins with etched tips for electrical die testINTEL CORP·Filed 2016·Granted Mar 24, 2020·0 cites·20 claims
- 1953US2016274148A1Composite wire probe test assemblyINTEL CORP·Filed 2016·Application pending·0 cites
- 2050US2022313069A1Systems and Methods for Application of Rigid and Flexible Adhesives for Cable Attachment to BGAsHIGH SPEED INTERCONNECTS LLC·Filed 2022·Application pending·0 cites
- 2149US11112430B2Probe head and electronic device testing systemINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 2248US6360544B1Anticyclone powered active thermal control unitINTEL CORP·Filed 2000·Granted Mar 26, 2002·4 cites·30 claims
- 2347US7375033B2Multi-layer interconnect with isolation layerMICRON TECHNOLOGY INC·Filed 2003·Granted May 20, 2008·2 cites·35 claims
- 2445US9581639B2Organic space transformer attachment and assemblyYANG JIN·Filed 2013·Granted Feb 28, 2017·0 cites·21 claims
- 2545US2021052142A1Methods and apparatus for cable attachment systemHIGH SPEED INTERCONNECTS LLC·Filed 2020·Application pending·0 cites
- 2644US9535095B2Anti-rotation for wire probes in a probe head of a die testerSHIA DAVID·Filed 2013·Granted Jan 3, 2017·0 cites·18 claims
- 2743US10578647B2Probes for wafer sortingINTEL CORP·Filed 2017·Granted Mar 3, 2020·0 cites·14 claims
- 2843US2016178663A1Formed wire probe interconnect for test die contactorINTEL CORP·Filed 2014·Application pending·0 cites
- 2938US9207258B2Composite wire probes for testing integrated circuitsSHIA DAVID·Filed 2012·Granted Dec 8, 2015·0 cites·20 claims
- 3029US2013269173A1Apparatus and method for automated sort probe assembly and repairALBERTSON TODD P·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →