Inventor · disambiguated record
Hao-Lin Yen
Also filed as: YEN HAO-LIN
4 granted patents·4 pending applications·0 citations·filing 2021–2025
56Inventor score
Files withRICHTEK TECHNOLOGY CORP8
Top patents by PatentIndex Score
8 records- 0176US12512395B2Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2024·Granted Dec 30, 2025·0 cites·7 claims
- 0267US12300565B2Chip package unit and chip packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Granted May 13, 2025·0 cites·9 claims
- 0365US11973010B2Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Apr 30, 2024·0 cites·12 claims
- 0460US2025140630A1Chip package unit and chip packaging methodRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0551US11469162B2Plurality of vertical heat conduction elements attached to metal filmRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Oct 11, 2022·0 cites·13 claims
- 0649US2023098393A1Lead frame and packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0748US2022208628A1Chip packaging structureRICHTEK TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0846US2022157622A1Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →