Inventor · disambiguated record
Takaaki Morita
Also filed as: MORITA TAKAAKI
19 granted patents·12 pending applications·87 citations·filing 2004–2024
92Inventor score
Top patents by PatentIndex Score
31 records- 0190US8026614B2Semiconductor IC-embedded substrate and method for manufacturing sameTDK CORP·Filed 2009·Granted Sep 27, 2011·17 cites·14 claims
- 0289US7247590B2Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring boardTDK CORP·Filed 2004·Granted Jul 24, 2007·30 cites·14 claims
- 0386US11412621B2Device-embedded board and method of manufacturing the sameTDK CORP·Filed 2020·Granted Aug 9, 2022·2 cites·8 claims
- 0483US7906370B2Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrateTDK CORP·Filed 2007·Granted Mar 15, 2011·12 cites·7 claims
- 0583US7544537B2Semiconductor IC-embedded substrate and method for manufacturing sameTDK CORP·Filed 2006·Granted Jun 9, 2009·9 cites·11 claims
- 0675US8544167B2Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrateMORITA TAKAAKI·Filed 2007·Granted Oct 1, 2013·9 cites·10 claims
- 0771US2024084091A1Porous filmTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 0865US12505958B2Solid electrolytic capacitor including a valve metal support and a cathodeTDK CORP·Filed 2023·Granted Dec 23, 2025·0 cites·6 claims
- 0965US8237059B2Electronic component-embedded board and method of manufacturing the sameKANEMARU YOSHIKAZU·Filed 2008·Granted Aug 7, 2012·4 cites·5 claims
- 1064US8530752B2Multilayer circuit board and method for manufacturing the sameKAWABATA KENICHI·Filed 2009·Granted Sep 10, 2013·2 cites·20 claims
- 1163US8188375B2Multilayer circuit board and method for manufacturing the sameKAWABATA KENICHI·Filed 2006·Granted May 29, 2012·2 cites·13 claims
- 1260US11546989B2Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer boardTDK CORP·Filed 2020·Granted Jan 3, 2023·0 cites·15 claims
- 1359US2024355554A1Solid electrolytic capacitor and method of manufacturing solid electrolytic capacitorTDK CORP·Filed 2024·Application pending·0 cites
- 1457US2025007231A1Laser medium unit, laser amplification device, and laser oscillation deviceHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 1551US10905013B2Printed wiring board and method for manufacturing the sameTDK CORP·Filed 2019·Granted Jan 26, 2021·0 cites·6 claims
- 1651US2023318245A1Laser device and method for manufacturing laser deviceHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 1751US2023335965A1Laser device, and method for manufacturing laser deviceHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 1851US2012285013A1Electronic Component-Embedded Board and Method of Manufacturing the SameKANEMARU YOSHIKAZU·Filed 2012·Application pending·0 cites
- 1950US11445605B2Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring boardTDK CORP·Filed 2020·Granted Sep 13, 2022·0 cites·13 claims
- 2049US10374377B2Laser medium, laser medium unit, and laser beam amplification deviceHAMAMATSU PHOTONICS KK·Filed 2016·Granted Aug 6, 2019·0 cites·3 claims
- 2149US2024418575A1Wavefront measurement device and wavefront measurement methodHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 2246US11382218B2Printed wiring board and method for manufacturing the sameTDK CORP·Filed 2019·Granted Jul 5, 2022·0 cites·3 claims
- 2345US10063026B2Laser beam amplification deviceHAMAMATSU PHOTONICS KK·Filed 2016·Granted Aug 28, 2018·0 cites·4 claims
- 2445US8005356B2Video transmission system of a ring networkMEDIA GLOBAL LINKS CO LTD·Filed 2008·Granted Aug 23, 2011·0 cites·12 claims
- 2545US2025147381A1Optical device and light production methodHAMAMATSU PHOTONICS KK·Filed 2023·Application pending·0 cites
- 2644US2008079146A1Semiconductor-embedded substrate and manufacturing method thereofTDK CORP·Filed 2007·Application pending·0 cites
- 2742US11335614B2Electric component embedded structureTDK CORP·Filed 2018·Granted May 17, 2022·0 cites·7 claims
- 2840US11114810B2Laser deviceHAMAMATSU PHOTONICS KK·Filed 2019·Granted Sep 7, 2021·0 cites·6 claims
- 2940US2009067323A1Duplicate Transmission Path Switching DeviceMATSUSHIMA HIROAKI·Filed 2005·Application pending·0 cites
- 3039US2007297795A1Bidirectional Optical Communication SystemKINOSHITA OSAMU·Filed 2004·Application pending·0 cites
- 3136US2017254936A1Light reflecting film, production method for light reflecting film, decorative molding method for light reflecting film, laminated glass, and curved surface bodyKONICA MINOLTA INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →