Electronic Component-Embedded Board and Method of Manufacturing the Same

Abstract

A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): α1<α3 and α2<α3  (1), is mounted on an unmounted portion of the electronic component on the substrate. In the formula, α1, α2 and α3 respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component, the plate-like frame member, and the substrate, the respective wiring layers or the respective insulating layers.

1 . A method of manufacturing an electronic component-embedded board, comprising:
 a step of preparing a substrate;   a step of mounting an electronic component on the substrate;   a step of mounting a member on an electronic component-unmounted portion of the substrate;   a step of forming an insulating layer on the substrate so as to cover the electronic component and the member; and   a step of forming a wiring layer on at least one of the substrate and the insulating layer,   wherein the member satisfies a relation represented by the following formula (1),
   α1<α3 and α2<α3  (1), in which
 
   α1 is the linear coefficient of thermal expansion of the electronic component (ppm/K),   α2 is the linear coefficient of thermal expansion of the member (ppm/K), and   α3 is the linear coefficient of thermal expansion of the substrate, the wiring layer or the insulating layer (ppm/K).   
     
     
         2 . The method of manufacturing an electronic component-embedded board according to  claim 1 , wherein the step of mounting the member includes mounting the member so as to surround the electronic component. 
     
     
         3 . The method of manufacturing an electronic component-embedded board according to  claim 1 , wherein the step of mounting the member includes mounting the electronic component and the member on approximately the same plane. 
     
     
         4 . The method of manufacturing an electronic component-embedded board according to  claim 1 , wherein, as the member, a member is used that is thinner than the electronic component.