Inventor · disambiguated record
Hiroya Sugimoto
Also filed as: SUGIMOTO HIROYA
6 granted patents·8 pending applications·612 citations·filing 2004–2023
82Inventor score
Top patents by PatentIndex Score
14 records- 0195USD609655SElectrostatic chuckNGK INSULATORS LTD·Filed 2009·Granted Feb 9, 2010·596 cites·1 claims
- 0276US8361271B2Ceramic-metal bonded body and method of producing the sameNGK INSULATORS LTD·Filed 2011·Granted Jan 29, 2013·4 cites·11 claims
- 0372US9257315B2Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatusNGK INSULATORS LTD·Filed 2014·Granted Feb 9, 2016·2 cites·22 claims
- 0472US9255747B2Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatusNGK INSULATORS LTD·Filed 2014·Granted Feb 9, 2016·2 cites·32 claims
- 0563US7250215B2Aluminum nitride sintered body containing carbon fibers and method of manufacturing the sameNGK INSULATORS LTD·Filed 2004·Granted Jul 31, 2007·8 cites·22 claims
- 0655US2024203784A1Member for semiconductor manufacturing apparatusNGK INSULATORS LTD·Filed 2023·Application pending·0 cites
- 0755US2024057223A1Wafer placement tableNGK INSULATORS LTD·Filed 2023·Application pending·0 cites
- 0855US2023284341A1Ceramic heaterNGK INSULATORS LTD·Filed 2023·Application pending·0 cites
- 0954US2023187261A1Wafer placement tableNGK INSULATORS LTD·Filed 2022·Application pending·0 cites
- 1051US2024120216A1Method of adjusting heat uniformity on wafer mount and method of manufacturing wafer mountNGK INSULATORS LTD·Filed 2023·Application pending·0 cites
- 1150US2024162016A1Wafer placement tableNGK INSULATORS LTD·Filed 2023·Application pending·0 cites
- 1245US2013093146A1Ceramic-metal bonded bodyNGK INSULATORS LTD·Filed 2012·Application pending·0 cites
- 1340US2005128674A1Ceramic chuckNGK INSULATORS LTD·Filed 2004·Application pending·0 cites
- 1439US8071913B2Heating deviceSUGIMOTO HIROYA·Filed 2007·Granted Dec 6, 2011·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →