Inventor · disambiguated record
Mikhail Haurylau
Also filed as: HAURYLAU MIKHAIL
8 granted patents·51 citations·filing 2013–2019
84Inventor score
Files withKLA TENCOR CORP8
Top patents by PatentIndex Score
8 records- 0194US9709510B2Determining a configuration for an optical element positioned in a collection aperture during wafer inspectionKLA TENCOR CORP·Filed 2015·Granted Jul 18, 2017·23 cites·39 claims
- 0290US9389349B2System and method to determine depth for optical wafer inspectionKLA TENCOR CORP·Filed 2013·Granted Jul 12, 2016·12 cites·23 claims
- 0388US9989479B1System and method to determine depth for optical wafer inspectionKLA TENCOR CORP·Filed 2016·Granted Jun 5, 2018·6 cites·35 claims
- 0486US9645093B2System and method for apodization in a semiconductor device inspection systemKLA TENCOR CORP·Filed 2015·Granted May 9, 2017·3 cites·46 claims
- 0584US9176069B2System and method for apodization in a semiconductor device inspection systemKLA TENCOR CORP·Filed 2013·Granted Nov 3, 2015·5 cites·44 claims
- 0676US10317347B2Determining information for defects on wafersKLA TENCOR CORP·Filed 2014·Granted Jun 11, 2019·2 cites·21 claims
- 0765US10571407B2Determining information for defects on wafersKLA TENCOR CORP·Filed 2019·Granted Feb 25, 2020·0 cites·20 claims
- 0857US10215713B2Determining a configuration for an optical element positioned in a collection aperture during wafer inspectionKLA TENCOR CORP·Filed 2017·Granted Feb 26, 2019·0 cites·40 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →