Inventor · disambiguated record
Jan Lauber
Also filed as: LAUBER JAN · LAUBER JAN A
15 granted patents·1 pending application·150 citations·filing 2000–2024
91Inventor score
Top patents by PatentIndex Score
16 records- 0191US7831083B1Image quality monitoring for substrate inspectionKLA TENCOR TECH CORP·Filed 2006·Granted Nov 9, 2010·20 cites·30 claims
- 0291US6664546B1In-situ probe for optimizing electron beam inspection and metrology based on surface potentialKLA TENCOR·Filed 2000·Granted Dec 16, 2003·49 cites·31 claims
- 0388US6828571B1Apparatus and methods of controlling surface charge and focusKLA TENCOR TECH CORP·Filed 2003·Granted Dec 7, 2004·40 cites·28 claims
- 0487US9311698B2Detecting defects on a wafer using template image matchingKLA TENCOR CORP·Filed 2013·Granted Apr 12, 2016·12 cites·35 claims
- 0586US9293298B2Defect discovery and inspection sensitivity optimization using automated classification of corresponding electron beam imagesKLA TENCOR CORP·Filed 2014·Granted Mar 22, 2016·7 cites·35 claims
- 0685US10483081B2Self directed metrology and pattern classificationKLA TENCOR CORP·Filed 2016·Granted Nov 19, 2019·4 cites·37 claims
- 0784US11244442B2Method and system for correlating optical images with scanning electron microscopy imagesKLA TENCOR CORP·Filed 2019·Granted Feb 8, 2022·3 cites·24 claims
- 0882US8106355B1Automated inspection using cell-cell subtraction perpendicular to stage motion directionLAUBER JAN·Filed 2008·Granted Jan 31, 2012·10 cites·5 claims
- 0977US10997710B2Adaptive care areas for die-die inspectionKLA TENCOR CORP·Filed 2018·Granted May 4, 2021·1 cites·20 claims
- 1075US10410338B2Method and system for correlating optical images with scanning electron microscopy imagesKLA TENCOR CORP·Filed 2014·Granted Sep 10, 2019·2 cites·28 claims
- 1171US12444174B2Rare event training data sets for robust training of semiconductor yield related componentsKLA CORP·Filed 2023·Granted Oct 14, 2025·0 cites·23 claims
- 1270US10854486B2System and method for characterization of buried defectsKLA TENCOR CORP·Filed 2018·Granted Dec 1, 2020·1 cites·29 claims
- 1370US10522376B2Multi-step image alignment method for large offset die-die inspectionKLA TENCOR CORP·Filed 2018·Granted Dec 31, 2019·1 cites·20 claims
- 1460US2025336181A1Combining deep learning model hidden layer output with specimen-specific input for defect classification or another semiconductor applicationKLA CORP·Filed 2024·Application pending·0 cites
- 1556US12100132B2Laser anneal pattern suppressionKLA CORP·Filed 2021·Granted Sep 24, 2024·0 cites·16 claims
- 1656US11774371B2Defect size measurement using deep learning methodsKLA CORP·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →