Inventor · disambiguated record
Glenn Omandam
Also filed as: OMANDAM GLENN
7 granted patents·69 citations·filing 2008–2013
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0193US8659162B2Semiconductor device having an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2011·Granted Feb 25, 2014·19 cites·25 claims
- 0293US8067308B2Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2009·Granted Nov 29, 2011·28 cites·27 claims
- 0382US9054083B2Semiconductor device and method of making TSV interconnect structures using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2013·Granted Jun 9, 2015·4 cites·25 claims
- 0482US8610286B2Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSPLIN YAOJIAN·Filed 2011·Granted Dec 17, 2013·5 cites·25 claims
- 0573US8916416B2Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surfaceOMANDAM GLENN·Filed 2010·Granted Dec 23, 2014·5 cites·34 claims
- 0672US7829384B2Semiconductor device and method of laser-marking wafers with tape applied to its active surfaceSTATS CHIPPAC LTD·Filed 2008·Granted Nov 9, 2010·6 cites·19 claims
- 0771US9281259B2Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSPSTATS CHIPPAC LTD·Filed 2013·Granted Mar 8, 2016·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →