Inventor · disambiguated record
Zhenhua Lu
Also filed as: LU ZHENHUA · LUE ZHENHUA
21 granted patents·2 pending applications·40 citations·filing 2001–2019
92Inventor score
Top patents by PatentIndex Score
23 records- 0189US9233511B2Method of making stamped multi-layer polymer lensOGANESIAN VAGE·Filed 2012·Granted Jan 12, 2016·7 cites·3 claims
- 0287US9666730B2Wire bond sensor packageOPTIZ INC·Filed 2015·Granted May 30, 2017·5 cites·16 claims
- 0385US9853079B2Method of forming a stress released image sensor package structureOPTIZ INC·Filed 2016·Granted Dec 26, 2017·4 cites·14 claims
- 0483US9985063B2Imaging device with photo detectors and color filters arranged by color transmission characteristics and absorption coefficientsOPTIZ INC·Filed 2015·Granted May 29, 2018·4 cites·18 claims
- 0580US9543347B2Stress released image sensor package structure and methodOPTIZ INC·Filed 2016·Granted Jan 10, 2017·3 cites·8 claims
- 0678US9496247B2Integrated camera module and method of making sameOPTIZ INC·Filed 2014·Granted Nov 15, 2016·4 cites·34 claims
- 0773US10139619B2Back side illumination image sensor with non-planar optical interfaceOPTIZ INC·Filed 2015·Granted Nov 27, 2018·2 cites·12 claims
- 0871US9893218B2Sensor package with cooling featureOPTIZ INC·Filed 2016·Granted Feb 13, 2018·1 cites·8 claims
- 0968US9893213B2Method of forming a wire bond sensor packageOPTIZ INC·Filed 2017·Granted Feb 13, 2018·1 cites·8 claims
- 1068US9219091B2Low profile sensor module and method of making sameOPTIZ INC·Filed 2014·Granted Dec 22, 2015·2 cites·23 claims
- 1164US9570634B2Sensor package with exposed sensor array and method of making sameOPTIZ INC·Filed 2015·Granted Feb 14, 2017·1 cites·16 claims
- 1264US9142695B2Sensor package with exposed sensor array and method of making sameOPTIZ INC·Filed 2014·Granted Sep 22, 2015·1 cites·18 claims
- 1362US9667900B2Three dimensional system-on-chip image sensor packageOPTIZ INC·Filed 2014·Granted May 30, 2017·1 cites·7 claims
- 1461US9190443B2Low profile image sensorOPTIZ INC·Filed 2014·Granted Nov 17, 2015·0 cites·14 claims
- 1558US10199519B2Method of making a sensor package with cooling featureOPTIZ INC·Filed 2018·Granted Feb 5, 2019·0 cites·6 claims
- 1658US9496297B2Sensor package with cooling feature and method of making sameOPTIZ INC·Filed 2014·Granted Nov 15, 2016·0 cites·6 claims
- 1756US9972730B2Method of making a sensor package with cooling featureOPTIZ INC·Filed 2016·Granted May 15, 2018·0 cites·4 claims
- 1855US9461190B2Low profile sensor package with cooling feature and method of making sameOPTIZ INC·Filed 2014·Granted Oct 4, 2016·0 cites·12 claims
- 1954US7077249B2Drum brakes with interconnected multi-degrees-of-freedom shoesUNIV TSINGHUA·Filed 2001·Granted Jul 18, 2006·4 cites·20 claims
- 2051US9666625B2Method of making low profile sensor package with cooling featureOPTIZ INC·Filed 2016·Granted May 30, 2017·0 cites·8 claims
- 2145US2015189204A1Semiconductor Device On Cover Substrate And Method Of Making SameOPTIZ INC·Filed 2014·Application pending·0 cites
- 2244US2014264693A1Cover-Free Sensor Module And Method Of Making SameOPTIZ INC·Filed 2014·Application pending·0 cites
- 2340US11210109B2Method and system for loading resourcesBANMA ZHIXING NETWORK CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →