Assignee
OGANESIAN VAGE
US·34 granted patents·3 pending applications·464 citations·filing 2010–2012
Top patents by PatentIndex Score
37 records- 0198US8847376B2Microelectronic elements with post-assembly planarizationOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·49 cites·28 claims
- 0298US8791575B2Microelectronic elements having metallic pads overlying viasOGANESIAN VAGE·Filed 2010·Granted Jul 29, 2014·87 cites·29 claims
- 0398US8598695B2Active chip on carrier or laminated chip having microelectronic element embedded thereinOGANESIAN VAGE·Filed 2010·Granted Dec 3, 2013·39 cites·29 claims
- 0497US8796135B2Microelectronic elements with rear contacts connected with via first or via middle structuresOGANESIAN VAGE·Filed 2010·Granted Aug 5, 2014·45 cites·24 claims
- 0596US8432011B1Wire bond interposer package for CMOS image sensor and method of making sameOGANESIAN VAGE·Filed 2011·Granted Apr 30, 2013·27 cites·26 claims
- 0695US8796800B2Interposer package for CMOS image sensor and method of making sameOGANESIAN VAGE·Filed 2011·Granted Aug 5, 2014·11 cites·4 claims
- 0795US8736066B2Stacked microelectronic assemby with TSVS formed in stages and carrier above chipOGANESIAN VAGE·Filed 2011·Granted May 27, 2014·17 cites·24 claims
- 0894US8610259B2Multi-function and shielded 3D interconnectsOGANESIAN VAGE·Filed 2010·Granted Dec 17, 2013·15 cites·36 claims
- 0994US8604576B2Low stress cavity package for back side illuminated image sensor, and method of making sameOGANESIAN VAGE·Filed 2011·Granted Dec 10, 2013·16 cites·12 claims
- 1094US8502340B2High density three-dimensional integrated capacitorsOGANESIAN VAGE·Filed 2010·Granted Aug 6, 2013·15 cites·19 claims
- 1193US8692344B2Back side illuminated image sensor architecture, and method of making sameOGANESIAN VAGE·Filed 2012·Granted Apr 8, 2014·16 cites·14 claims
- 1293US8486758B2Simultaneous wafer bonding and interconnect joiningOGANESIAN VAGE·Filed 2011·Granted Jul 16, 2013·14 cites·48 claims
- 1392US8546900B23D integration microelectronic assembly for integrated circuit devicesOGANESIAN VAGE·Filed 2011·Granted Oct 1, 2013·12 cites·11 claims
- 1491US8847380B2Staged via formation from both sides of chipOGANESIAN VAGE·Filed 2010·Granted Sep 30, 2014·10 cites·25 claims
- 1591US8759930B2Low profile image sensor packageOGANESIAN VAGE·Filed 2012·Granted Jun 24, 2014·9 cites·13 claims
- 1690US8552518B23D integrated microelectronic assembly with stress reducing interconnectsOGANESIAN VAGE·Filed 2011·Granted Oct 8, 2013·10 cites·16 claims
- 1789US9233511B2Method of making stamped multi-layer polymer lensOGANESIAN VAGE·Filed 2012·Granted Jan 12, 2016·7 cites·3 claims
- 1889US9018725B2Stepped package for image sensor and method of making sameOGANESIAN VAGE·Filed 2011·Granted Apr 28, 2015·9 cites·2 claims
- 1987US8570669B2Multi-layer polymer lens and method of making sameOGANESIAN VAGE·Filed 2012·Granted Oct 29, 2013·8 cites·32 claims
- 2087US8546951B23D integration microelectronic assembly for integrated circuit devicesOGANESIAN VAGE·Filed 2011·Granted Oct 1, 2013·7 cites·9 claims
- 2183US9099479B2Carrier structures for microelectronic elementsOGANESIAN VAGE·Filed 2012·Granted Aug 4, 2015·4 cites·25 claims
- 2283US8937361B2BSI image sensor package with variable-height silicon for even reception of different wavelengthsOGANESIAN VAGE·Filed 2011·Granted Jan 20, 2015·3 cites·36 claims
- 2383US8697569B2Non-lithographic formation of three-dimensional conductive elementsOGANESIAN VAGE·Filed 2010·Granted Apr 15, 2014·5 cites·63 claims
- 2483US8685793B2Chip assembly having via interconnects joined by platingOGANESIAN VAGE·Filed 2010·Granted Apr 1, 2014·6 cites·32 claims
- 2583US8610264B2Compliant interconnects in wafersOGANESIAN VAGE·Filed 2010·Granted Dec 17, 2013·5 cites·25 claims
- 2682US8921759B2Integrated image sensor package with liquid crystal lensOGANESIAN VAGE·Filed 2012·Granted Dec 30, 2014·6 cites·42 claims
- 2780US8587126B2Stacked microelectronic assembly with TSVs formed in stages with plural active chipsOGANESIAN VAGE·Filed 2011·Granted Nov 19, 2013·4 cites·11 claims
- 2875US9041133B2BSI image sensor package with embedded absorber for even reception of different wavelengthsOGANESIAN VAGE·Filed 2011·Granted May 26, 2015·4 cites·29 claims
- 2971US8115308B2Microelectronic assemblies having compliancy and methods thereforOGANESIAN VAGE·Filed 2010·Granted Feb 14, 2012·2 cites·19 claims
- 3066US8512491B2Dual wafer spin coatingOGANESIAN VAGE·Filed 2010·Granted Aug 20, 2013·1 cites·32 claims
- 3162US8841763B2Three-dimensional system-in-a-packageOGANESIAN VAGE·Filed 2011·Granted Sep 23, 2014·1 cites·5 claims
- 3252US8759973B2Microelectronic assemblies having compliancy and methods thereforOGANESIAN VAGE·Filed 2011·Granted Jun 24, 2014·0 cites·20 claims
- 3341US2013168791A1Quantum Efficiency Back Side Illuminated CMOS Image Sensor And Package, And Method Of Making SameOGANESIAN VAGE·Filed 2012·Application pending·0 cites
- 3441US2013249031A1Quantum Efficiency Back Side Illuminated CMOS Image Sensor And Package, And Method Of Making SameOGANESIAN VAGE·Filed 2012·Application pending·0 cites
- 3539US8686565B2Stacked chip assembly having vertical viasOGANESIAN VAGE·Filed 2010·Granted Apr 1, 2014·0 cites·50 claims
- 3639US2012199924A1Bsi image sensor package with variable light transmission for even reception of different wavelengthsOGANESIAN VAGE·Filed 2011·Application pending·0 cites
- 3738US9640437B2Methods of forming semiconductor elements using micro-abrasive particle streamOGANESIAN VAGE·Filed 2010·Granted May 2, 2017·0 cites·51 claims
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