Inventor · disambiguated record
Phillip M. Rayer, Ii
Also filed as: RAYER II PHILLIP · RAYER II PHILLIP M
4 granted patents·67 citations·filing 1999–2004
77Inventor score
Top patents by PatentIndex Score
4 records- 0189US6802955B2Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surfaceSPEEDFAM IPEC CORP·Filed 2002·Granted Oct 12, 2004·43 cites·31 claims
- 0269US7297239B2Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surfaceNOVELLUS SYSTEMS INC·Filed 2004·Granted Nov 20, 2007·11 cites·25 claims
- 0347US6406362B1Seal for use with a chemical mechanical planarization apparatusSPEEDFAM IPEC CORP·Filed 2001·Granted Jun 18, 2002·3 cites·26 claims
- 0438US6241226B1Vacuum system coupled to a wafer chuck for holding wet wafersSPEEDFAM IPEC CORP·Filed 1999·Granted Jun 5, 2001·10 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →