Inventor · disambiguated record
Chih-Ming Tzeng
Also filed as: TZENG CHIH-MING
9 granted patents·2 pending applications·126 citations·filing 2005–2023
86Inventor score
Top patents by PatentIndex Score
11 records- 0197US7294920B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2005·Granted Nov 13, 2007·92 cites·5 claims
- 0292US7528009B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2007·Granted May 5, 2009·20 cites·18 claims
- 0380US8314482B2Semiconductor package deviceCHEN SHOU-LUNG·Filed 2007·Granted Nov 20, 2012·8 cites·20 claims
- 0476US10672677B2Semiconductor package structureIND TECH RES INST·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 0571US9059181B2Wafer leveled chip packaging structure and method thereofINVENSAS CORP·Filed 2013·Granted Jun 16, 2015·2 cites·14 claims
- 0669US10288696B2Intelligent diagnosis system for power module and method thereofIND TECH RES INST·Filed 2016·Granted May 14, 2019·1 cites·18 claims
- 0764US12334854B2Power integrated module and motor control systemIND TECH RES INST·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0864US8587091B2Wafer-leveled chip packaging structure and method thereofCHEN SHOU-LUNG·Filed 2012·Granted Nov 19, 2013·1 cites·4 claims
- 0950US2024162114A1Power moduleIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1044US2017084521A1Semiconductor package structureIND TECH RES INST·Filed 2016·Application pending·0 cites
- 1136US9601474B2Electrically stackable semiconductor wafer and chip packagesINVENSAS CORP·Filed 2015·Granted Mar 21, 2017·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →