Inventor · disambiguated record
Hui-Ying Hsieh
Also filed as: HSIEH HUI-YING
10 granted patents·2 pending applications·4 citations·filing 2010–2020
80Inventor score
Top patents by PatentIndex Score
12 records- 0175US10707157B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 7, 2020·2 cites·14 claims
- 0269US11133245B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·1 cites·17 claims
- 0367US10083888B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 25, 2018·1 cites·17 claims
- 0465US11728252B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 15, 2023·0 cites·15 claims
- 0557US2020194327A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 0656US11037868B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 15, 2021·0 cites·17 claims
- 0754US10615105B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Apr 7, 2020·0 cites·18 claims
- 0852US2018358276A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 0951US8889488B2Method for manufacturing semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 18, 2014·0 cites·20 claims
- 1049US11127707B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 1144US12033923B2Semiconductor package structure having a lead frame and a passive componentADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 9, 2024·0 cites·16 claims
- 1239US8546950B2Semiconductor package and manufacturing method thereofCHAO SHIN-HUA·Filed 2010·Granted Oct 1, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →