Inventor · disambiguated record
Ja Eun Yun
Also filed as: YUN JA EUN
3 granted patents·17 citations·filing 2007–2007
62Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0183US7656017B2Integrated circuit package system with thermo-mechanical interlocking substratesSTATS CHIPPAC LTD·Filed 2007·Granted Feb 2, 2010·14 cites·20 claims
- 0257US8956914B2Integrated circuit package system with overhang dieYUN JA EUN·Filed 2007·Granted Feb 17, 2015·3 cites·16 claims
- 0344US8067275B2Integrated circuit package system with package integrationKO WONJUN·Filed 2007·Granted Nov 29, 2011·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Ja Eun Yun files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →