Inventor · disambiguated record
You-Seung Jin
Also filed as: JIN YOU-SEUNG
10 granted patents·4 pending applications·169 citations·filing 2003–2012
89Inventor score
Top patents by PatentIndex Score
14 records- 0195US7642106B2Methods for identifying an allowable process margin for integrated circuitsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 5, 2010·81 cites·16 claims
- 0285US7244666B2Multi-gate transistor formed with active patterns of uniform critical dimensionSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 17, 2007·12 cites·16 claims
- 0384US6765255B2Semiconductor device having metal-insulator-metal capacitor and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 20, 2004·39 cites·18 claims
- 0483US7840917B2Method of correcting a design pattern for an integrated circuit and an apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 23, 2010·7 cites·23 claims
- 0573US7696051B2Method of fabricating a MOSFET having doped epitaxially grown source/drain region on recessed substrateSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 13, 2010·5 cites·6 claims
- 0669US7008835B2Method of manufacturing a semiconductor device having a gate structure with low parasitic capacitanceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 7, 2006·13 cites·10 claims
- 0765US6960785B2MOSFET and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 1, 2005·10 cites·11 claims
- 0862US7332400B2Method of manufacturing a semiconductor device having a gate structure with low parasitic capacitanceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 19, 2008·2 cites·13 claims
- 0948US8252630B2Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip packageLEE SE-YOUNG·Filed 2008·Granted Aug 28, 2012·0 cites·16 claims
- 1046US8530275B2Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip packageLEE SE-YOUNG·Filed 2012·Granted Sep 10, 2013·0 cites·3 claims
- 1142US2007034970A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1238US2006065893A1Method of forming gate by using layer-growing process and gate structure manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1336US2006017119A1Multi-gate transistor and method of fabricating multi-gate transistorJIN YOU-SEUNG·Filed 2005·Application pending·0 cites
- 1434US2011033989A1Semiconductor device having multi-gate structure and method of manufacturing the sameCHOI JUNG-A·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →