Inventor · disambiguated record
Wael Zohni
Also filed as: ZOHNI WAEL · ZOHNI WAEL O
147 granted patents·11 pending applications·2,126 citations·filing 2000–2025
99Inventor score
Top patents by PatentIndex Score
158 records- 0199US8670261B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2013·Granted Mar 11, 2014·78 cites·28 claims
- 0299US8405207B1Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Mar 26, 2013·42 cites·30 claims
- 0399US8345441B1Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2011·Granted Jan 1, 2013·70 cites·30 claims
- 0498US10115678B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2017·Granted Oct 30, 2018·26 cites·20 claims
- 0598US9812402B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·30 cites·20 claims
- 0698US8907500B2Multi-die wirebond packages with elongated windowsINVENSAS CORP·Filed 2013·Granted Dec 9, 2014·47 cites·21 claims
- 0798US8823165B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Sep 2, 2014·34 cites·54 claims
- 0898US8659141B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·37 cites·30 claims
- 0998US8659142B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 1098US8659143B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 1198US8653646B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 18, 2014·31 cites·30 claims
- 1298US8513813B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 20, 2013·39 cites·30 claims
- 1398US8513817B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Aug 20, 2013·65 cites·50 claims
- 1498US8502390B2De-skewed multi-die packagesCRISP RICHARD DEWITT·Filed 2011·Granted Aug 6, 2013·42 cites·36 claims
- 1598US8441111B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2012·Granted May 14, 2013·49 cites·30 claims
- 1698US8436457B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2011·Granted May 7, 2013·45 cites·30 claims
- 1798US8436477B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted May 7, 2013·48 cites·30 claims
- 1898US8378478B2Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contactsTESSERA INC·Filed 2010·Granted Feb 19, 2013·48 cites·26 claims
- 1998US8338963B2Multiple die face-down stacking for two or more dieHABA BELGACEM·Filed 2011·Granted Dec 25, 2012·51 cites·30 claims
- 2098US8254155B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 28, 2012·68 cites·30 claims
- 2197US11810867B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2022·Granted Nov 7, 2023·2 cites·28 claims
- 2297US9735084B2Bond via array for thermal conductivityINVENSAS CORP·Filed 2014·Granted Aug 15, 2017·38 cites·20 claims
- 2397US9490222B1Wire bond wires for interference shieldingINVENSAS CORP·Filed 2015·Granted Nov 8, 2016·20 cites·20 claims
- 2497US9117811B2Flip chip assembly and process with sintering material on metal bumpsZOHNI WAEL·Filed 2011·Granted Aug 25, 2015·41 cites·20 claims
- 2597US9000583B2Multiple die in a face down packageTESSERA INC·Filed 2013·Granted Apr 7, 2015·26 cites·5 claims
- 2697US8659139B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 2797US8659140B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 2897US8629545B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Jan 14, 2014·32 cites·28 claims
- 2997US8610260B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Dec 17, 2013·35 cites·31 claims
- 3097US8525327B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Sep 3, 2013·33 cites·30 claims
- 3197US8304881B1Flip-chip, face-up and face-down wirebond combination packageHABA BELGACEM·Filed 2011·Granted Nov 6, 2012·28 cites·22 claims
- 3297US8278764B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Oct 2, 2012·36 cites·30 claims
- 3397US6977440B2Stacked packagesTESSERA INC·Filed 2003·Granted Dec 20, 2005·168 cites·33 claims
- 3496US10559537B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2018·Granted Feb 11, 2020·10 cites·18 claims
- 3596US8981547B2Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2014·Granted Mar 17, 2015·24 cites·20 claims
- 3696US8952516B2Multiple die stacking for two or more dieTESSERA INC·Filed 2012·Granted Feb 10, 2015·20 cites·27 claims
- 3796US8917532B2Stub minimization with terminal grids offset from center of packageINVENSAS CORP·Filed 2012·Granted Dec 23, 2014·25 cites·34 claims
- 3896US8081474B1Embossed heat spreaderZOHNI WAEL O·Filed 2008·Granted Dec 20, 2011·128 cites·39 claims
- 3996US7994622B2Microelectronic packages having cavities for receiving microelectric elementsTESSERA INC·Filed 2008·Granted Aug 9, 2011·37 cites·18 claims
- 4095US10490528B2Embedded wire bond wiresINVENSAS CORP·Filed 2016·Granted Nov 26, 2019·17 cites·10 claims
- 4194US9972609B2Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods thereforINVENSAS CORP·Filed 2016·Granted May 15, 2018·8 cites·9 claims
- 4294US7335995B2Microelectronic assembly having array including passive elements and interconnectsTESSERA INC·Filed 2005·Granted Feb 26, 2008·35 cites·17 claims
- 4393US10354976B2Dies-on-package devices and methods thereforINVENSAS CORP·Filed 2016·Granted Jul 16, 2019·6 cites·16 claims
- 4493US8928153B2Flip-chip, face-up and face-down centerbond memory wirebond assembliesHABA BELGACEM·Filed 2011·Granted Jan 6, 2015·13 cites·23 claims
- 4593US8786069B1Reconfigurable popINVENSAS CORP·Filed 2013·Granted Jul 22, 2014·14 cites·27 claims
- 4692US9013033B2Multiple die face-down stacking for two or more dieTESSERA INC·Filed 2013·Granted Apr 21, 2015·12 cites·43 claims
- 4792US8723329B1In-package fly-by signalingINVENSAS CORP·Filed 2013·Granted May 13, 2014·13 cites·29 claims
- 4892US7176043B2Microelectronic packages and methods thereforTESSERA INC·Filed 2004·Granted Feb 13, 2007·69 cites·54 claims
- 4991US9991235B2Package on-package devices with upper RDL of WLPS and methods thereforINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·5 cites·9 claims
- 5091US9991233B2Package-on-package devices with same level WLP components and methods thereforINVENSAS CORP·Filed 2016·Granted Jun 5, 2018·5 cites·19 claims
Showing the top 50 of 158 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →