Inventor · disambiguated record
Kyung Woon Jang
Also filed as: JANG KYUNG WOON
6 granted patents·3 pending applications·20 citations·filing 2004–2019
78Inventor score
Top patents by PatentIndex Score
9 records- 0192US10105943B2Lamination apparatus and lamination method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 23, 2018·8 cites·11 claims
- 0274US11387220B2Display comprising light-emitting chips and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 12, 2022·2 cites·15 claims
- 0373US8327534B2Method of fabricating printed circuit board assemblyPARK MIN YOUNG·Filed 2010·Granted Dec 11, 2012·3 cites·12 claims
- 0472US11437410B2Display apparatus and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 6, 2022·2 cites·10 claims
- 0567US10229306B2Fingerprint recognition device, method of manufacturing the same, and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 12, 2019·2 cites·19 claims
- 0649US7381468B2Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using sameKOREA ADVANCED INST SCI & TECH·Filed 2004·Granted Jun 3, 2008·3 cites·13 claims
- 0744US2009029504A1Wafer-level aca flip chip package using double-layered aca/ncaKOREA ADVANCED INST SCI & TECH·Filed 2008·Application pending·0 cites
- 0839US2013202848A1Functional sheetSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0935US2012018084A1Printed Circuit Board Assembly Manufacturing Device And MethodJANG KYUNG WOON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →