Printed Circuit Board Assembly Manufacturing Device And Method

Abstract

Disclosed herein is a printed circuit board assembly manufacturing device and method of manufacturing a printed circuit board assembly. The printed circuit board assembly manufacturing device may include a fusing unit configured to cure a conductive adhesive used to fix electronic components having different heights to a printed circuit board. The fusing unit may be configured to cure the conductive adhesive while simultaneously applying pressure to the electronic components having different heights.

1 . A printed circuit board assembly manufacturing device comprising:
 a stage configured to support a printed circuit board, the printed circuit board including electronic components having different heights bonded to the printed circuit board by a conductive adhesive; and   a fusing unit configured to simultaneously apply pressure and heat to the printed circuit board to cure the conductive adhesive.   
     
     
         2 . The printed circuit board assembly manufacturing device according to  claim 1 , wherein the fusing unit includes
 a buffer member configured to apply a uniform pressure to the electronic components having the different heights, and   elastic particles arranged to press against the buffer member to apply the uniform pressure to the electronic components having the different heights.   
     
     
         3 . The printed circuit board assembly manufacturing device according to  claim 2 , wherein the fusing unit further includes
 a housing provided with a cavity in which the elastic particles are provided, and   a pressure member movably provided in the housing, the pressure member being configured to apply pressure to the elastic particles.   
     
     
         4 . The printed circuit board assembly manufacturing device according to  claim 2 , wherein the elastic particles and the buffer member are configured to deform to shapes corresponding to the electronic components having the different heights, and fill gaps between the electronic components having the different heights. 
     
     
         5 . The printed circuit board assembly manufacturing device according to  claim 3 , wherein at least one of the housing and the pressure member includes a heater to supply heat to the conductive adhesive. 
     
     
         6 . The printed circuit board assembly manufacturing device according to  claim 1 , wherein the conductive adhesive includes an Anisotropic Conductive Film (ACF). 
     
     
         7 . The printed circuit board assembly manufacturing device according to  claim 2 , wherein the buffer member includes one of a polymer sheet and a polymer film. 
     
     
         8 . The printed circuit board assembly manufacturing device according to  claim 1 , wherein the fusing unit includes
 a buffer member configured to cover and apply a relatively uniform pressure to the electronic components having the different heights, and   a pneumatic pressure supply unit configured to apply pressure to the buffer member.   
     
     
         9 . The printed circuit board assembly manufacturing device according to  claim 8 , wherein the fusing unit further includes a housing with a cavity and the pneumatic pressure supply unit supplies pneumatic pressure to the cavity of the housing. 
     
     
         10 . The printed circuit board assembly manufacturing device according to  claim 1 , wherein the fusing unit includes:
 a buffer member configured to cover and apply a relatively uniform pressure to the electronic components having the different heights; and   a hydraulic pressure supply unit configured to apply uniform pressure to the buffer member.   
     
     
         11 . The printed circuit board assembly manufacturing device according to  claim 10 , wherein the fusing unit further includes a housing provided with a cavity and the hydraulic pressure supply unit supplies hydraulic pressure to the cavity of the housing. 
     
     
         12 . A printed circuit board assembly manufacturing device comprising:
 a stage provided with a layer configured to support a printed circuit board, the printed circuit board including electronic components having different heights bonded to upper and lower surfaces of the printed circuit board by conductive adhesives; and   a fusing unit configured to cure the respective conductive adhesives while simultaneously applying pressure to the electronic components having the different heights bonded to the upper and lower surfaces of the printed circuit board, wherein the layer includes a flexible material.   
     
     
         13 . The printed circuit board assembly manufacturing device according to  claim 12 , wherein the layer is configured to deform to shapes corresponding to the electronic components having the different heights. 
     
     
         14 . The printed circuit board assembly manufacturing device according to  claim 12 , further comprising:
 a Teflon sheet between the layer and the electronic components having the different heights.   
     
     
         15 . A printed circuit board assembly manufacturing device comprising:
 a clamping unit configured to fix a printed circuit board, the printed circuit board having an upper and lower surface, the upper surface including a first plurality of electronic components having different heights bonded thereon by a first conductive adhesive and the lower surface including a second plurality of electronic components having different heights bonded thereon by a second conductive adhesive;   a first fusing unit configured to cure the first conductive adhesive by simultaneously applying pressure and heat to the first plurality of electronic components; and   a second fusing unit configured to cure the second conductive adhesive by simultaneously applying pressure and heat to the second plurality of electronic components.   
     
     
         16 . A printed circuit board assembly manufacturing method comprising:
 attaching a conductive adhesive to a printed circuit board, the conductive adhesive including a release tape;   bonding electronic components having different heights to the printed circuit board by removing the release paper from the conductive adhesive; and   simultaneously applying pressure to the electronic components having the different heights via elastic particles to cure the conductive adhesive.   
     
     
         17 . The printed circuit board assembly manufacturing method according to  claim 16 , wherein applying pressure includes moving the elastic particles between the electronic components to fill gaps between the electronic components and pressing the elastic particles are deformed to shapes corresponding to the electronic components having different heights. 
     
     
         18 . The printed circuit board assembly manufacturing method according to  claim 16 , wherein heat is supplied to the conductive adhesive a heater. 
     
     
         19 . A printed circuit board assembly manufacturing method comprising:
 attaching a conductive adhesive to a printed circuit board;   bonding electronic components having different heights to the printed circuit board by removing a release paper from the conductive adhesive; and   simultaneously applying pressure to the electronic components having the different heights through one of a pneumatic and hydraulic, pressure supply unit to cure the conductive adhesive.   
     
     
         20 . A printed circuit board assembly manufacturing method comprising:
 attaching conductive adhesives to upper and lower surfaces of a printed circuit board;   bonding electronic components having different heights to the upper and lower surfaces of the printed circuit board by removing a release paper from each of the conductive adhesives;   simultaneously applying pressure and heat to the electronic components having the different heights bonded to the upper surface of the printed circuit board through a fusing unit so as to cure the conductive adhesive on the upper surface of the printed circuit board; and   simultaneously applying pressure and heat to the electronic components having the different heights bonded to the lower surface of the printed circuit board through a layer made of a flexible material so as to cure the conductive adhesive on the lower surface of the printed circuit board.   
     
     
         21 . A printed circuit board assembly manufacturing method comprising:
 bonding electronic components having different heights to upper and lower surfaces of the printed circuit board using conductive adhesives;   simultaneously applying pressure and heat to the electronic components having the different heights bonded to the upper surface of the printed circuit board through a first fusing unit to cure the conductive adhesive on the upper surface of the substrate; and   simultaneously applying pressure and heat to the electronic components having the different heights bonded to the lower surface of the printed circuit board through a second fusing unit to cure the conductive adhesive on the lower surface of the substrate.   
     
     
         22 . A printed circuit board assembly comprising:
 a printed circuit board;   a conductive adhesive on the printed circuit board; and   electronic components having different heights bonded to the printed circuit board,   wherein the conductive adhesive is cured while simultaneously applying pressure and heat to the electronic components having different heights.