Inventor · disambiguated record
Brad L. Mays
Also filed as: MAYS BRAD · MAYS BRAD L · MAYS BRAD LEROY
19 granted patents·1 pending application·528 citations·filing 2000–2019
94Inventor score
Top patents by PatentIndex Score
20 records- 0196US6364957B1Support assembly with thermal expansion compensationAPPLIED MATERIALS INC·Filed 2000·Granted Apr 2, 2002·368 cites·55 claims
- 0295US10378108B2Showerhead with reduced backside plasma ignitionAPPLIED MATERIALS INC·Filed 2016·Granted Aug 13, 2019·6 cites·20 claims
- 0393US9666466B2Electrostatic chuck having thermally isolated zones with minimal crosstalkAPPLIED MATERIALS INC·Filed 2014·Granted May 30, 2017·10 cites·20 claims
- 0493US6353210B1Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using and in-situ wafer temperature optical probeAPPLIED MATERIALS INC·Filed 2000·Granted Mar 5, 2002·85 cites·20 claims
- 0592US10745807B2Showerhead with reduced backside plasma ignitionAPPLIED MATERIALS INC·Filed 2019·Granted Aug 18, 2020·3 cites·20 claims
- 0684US6575622B2Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using an in-situ wafer temperature optical probeAPPLIED MATERIALS INC·Filed 2001·Granted Jun 10, 2003·31 cites·4 claims
- 0782US9338871B2Feedforward temperature control for plasma processing apparatusMAHADESWARASWAMY CHETAN·Filed 2010·Granted May 10, 2016·5 cites·14 claims
- 0882US8916793B2Temperature control in plasma processing apparatus using pulsed heat transfer fluid flowSILVEIRA FERNANDO M·Filed 2011·Granted Dec 23, 2014·7 cites·13 claims
- 0976US9991148B2Electrostatic chuck having thermally isolated zones with minimal crosstalkAPPLIED MATERIALS INC·Filed 2017·Granted Jun 5, 2018·1 cites·20 claims
- 1073US10490429B2Substrate carrier using a proportional thermal fluid delivery systemAPPLIED MATERIALS INC·Filed 2014·Granted Nov 26, 2019·2 cites·14 claims
- 1171US10546731B1Method, apparatus and system for wafer dechucking using dynamic voltage sweepingAPPLIED MATERIALS INC·Filed 2018·Granted Jan 28, 2020·1 cites·20 claims
- 1269US10854425B2Feedforward temperature control for plasma processing apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Dec 1, 2020·1 cites·8 claims
- 1362US11088005B2Electrostatic chuck having thermally isolated zones with minimal crosstalkAPPLIED MATERIALS INC·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 1462US6898065B2Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing systemFiled 2002·Granted May 24, 2005·8 cites·7 claims
- 1561US10928145B2Dual zone common catch heat exchanger/chillerAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·0 cites·11 claims
- 1661US10304715B2Electrostatic chuck having thermally isolated zones with minimal crosstalkAPPLIED MATERIALS INC·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 1760US11615973B2Substrate carrier using a proportional thermal fluid delivery systemAPPLIED MATERIALS INC·Filed 2019·Granted Mar 28, 2023·0 cites·7 claims
- 1859US9214315B2Temperature control in plasma processing apparatus using pulsed heat transfer fluid flowAPPLIED MATERIALS INC·Filed 2014·Granted Dec 15, 2015·0 cites·7 claims
- 1955US10274270B2Dual zone common catch heat exchanger/chillerAPPLIED MATERIALS INC·Filed 2012·Granted Apr 30, 2019·0 cites·9 claims
- 2037US2003010292A1Electrostatic chuck with dielectric coatingAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →