Inventor · disambiguated record
Tatsuo Hatano
Also filed as: HATANO TATSUO
55 granted patents·21 pending applications·2,195 citations·filing 1995–2024
98Inventor score
Top patents by PatentIndex Score
76 records- 0198US11764092B2Substrate transfer apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Sep 19, 2023·6 cites·4 claims
- 0298US5595606AShower head and film forming apparatus using the sameTOKYO ELECTRON LTD·Filed 1996·Granted Jan 21, 1997·1.2k cites·20 claims
- 0397US12183612B2Substrate transfer apparatus, substrate transfer method, and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Granted Dec 31, 2024·4 cites·12 claims
- 0496US12211720B2Vacuum transfer device, substrate processing system, and substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Jan 28, 2025·3 cites·20 claims
- 0596US11990357B2Substrate transport apparatus, substrate transport method, and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Granted May 21, 2024·3 cites·16 claims
- 0696US6659111B1Cleaning gas and method for cleaning vacuum treatment apparatus by flowing the cleaning gasCENTRAL GLASS CO LTD·Filed 2000·Granted Dec 9, 2003·312 cites·11 claims
- 0793US5709757AFilm forming and dry cleaning apparatus and methodTOKYO ELECTRON LTD·Filed 1995·Granted Jan 20, 1998·160 cites·63 claims
- 0892US5989345AProcess-gas supply apparatusTOKYO ELECTRON LTD·Filed 1998·Granted Nov 23, 1999·108 cites·12 claims
- 0988US6989321B2Low-pressure deposition of metal layers from metal-carbonyl precursorsIBM·Filed 2003·Granted Jan 24, 2006·41 cites·32 claims
- 1087US8399353B2Methods of forming copper wiring and copper film, and film forming systemISHIZAKA TADAHIRO·Filed 2011·Granted Mar 19, 2013·9 cites·13 claims
- 1187US7427426B2CVD method for forming metal film by using metal carbonyl gasTOKYO ELECTRON LTD·Filed 2005·Granted Sep 23, 2008·6 cites·13 claims
- 1285US5690743ALiquid material supply apparatus and methodTOKYO ELECTRON LTD·Filed 1995·Granted Nov 25, 1997·79 cites·5 claims
- 1384US6924223B2Method of forming a metal layer using an intermittent precursor gas flow processIBM·Filed 2003·Granted Aug 2, 2005·32 cites·53 claims
- 1481US5963834AMethod for forming a CVD filmTOKYO ELECTRON LTD·Filed 1997·Granted Oct 5, 1999·62 cites·15 claims
- 1580US8029873B2Film deposition method and film deposition apparatus of metal filmTOKYO ELECTRON LTD·Filed 2006·Granted Oct 4, 2011·7 cites·9 claims
- 1679US8026176B2Film forming method, plasma film forming apparatus and storage mediumTOKYO ELECTRON LTD·Filed 2007·Granted Sep 27, 2011·6 cites·12 claims
- 1778US7790626B2Plasma sputtering film deposition method and equipmentTOKYO ELECTRON LTD·Filed 2005·Granted Sep 7, 2010·8 cites·10 claims
- 1878US5954887ACleaning processing method of a film forming apparatusTOKYO ELECTRON LTD·Filed 1998·Granted Sep 21, 1999·43 cites·14 claims
- 1976US7491430B2Deposition method for forming a film including metal, nitrogen and carbonTOKYO ELECTRON LTD·Filed 2005·Granted Feb 17, 2009·5 cites·13 claims
- 2075US8349283B2Metal recovery method, metal recovery apparatus, gas exhaust system and film forming device using sameTOKYO ELECTRON LTD·Filed 2009·Granted Jan 8, 2013·4 cites·26 claims
- 2174US12033878B2Substrate transfer apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2023·Granted Jul 9, 2024·0 cites·4 claims
- 2273US8859422B2Method of forming copper wiring and method and system for forming copper filmISHIZAKA TADAHIRO·Filed 2012·Granted Oct 14, 2014·3 cites·26 claims
- 2372US10068798B2Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrateTOKYO ELECTRON LTD·Filed 2017·Granted Sep 4, 2018·1 cites·4 claims
- 2471US10189230B2Method for forming copper filmTOKYO ELECTRON LTD·Filed 2017·Granted Jan 29, 2019·1 cites·5 claims
- 2571US9576850B2Method for manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2013·Granted Feb 21, 2017·2 cites·7 claims
- 2671US8992686B2Mounting table structure, film forming apparatus and raw material recovery methodGOMI ATSUSHI·Filed 2011·Granted Mar 31, 2015·3 cites·41 claims
- 2771US8129271B2Film forming method, film forming apparatus and storage mediumKOJIMA YASUHIKO·Filed 2007·Granted Mar 6, 2012·3 cites·6 claims
- 2870US7078341B2Method of depositing metal layers from metal-carbonyl precursorsIBM·Filed 2003·Granted Jul 18, 2006·12 cites·40 claims
- 2967US9976217B2Film forming method using reversible decomposition reactionTOKYO ELECTRON LTD·Filed 2014·Granted May 22, 2018·1 cites·4 claims
- 3066US9362167B2Method of supplying cobalt to recessTOKYO ELECTRON LTD·Filed 2015·Granted Jun 7, 2016·1 cites·6 claims
- 3166US8133811B2Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, computer program and storage mediumKOJIMA YASUHIKO·Filed 2007·Granted Mar 13, 2012·3 cites·5 claims
- 3266US7879399B2CV method using metal carbonyl gasTOKYO ELECTRON LTD·Filed 2008·Granted Feb 1, 2011·0 cites·15 claims
- 3364US8277889B2Film formation method and film formation apparatusGOMI ATSUSHI·Filed 2008·Granted Oct 2, 2012·2 cites·4 claims
- 3462US7344754B2Film formation methodTOKYO ELECTRON LTD·Filed 2005·Granted Mar 18, 2008·1 cites·11 claims
- 3562US5704214AApparatus for removing tramp materials and method thereforTOKYO ELECTRON LTD·Filed 1996·Granted Jan 6, 1998·28 cites·5 claims
- 3662US2024410050A1Stage structure, substrate processing apparatus, and temperature control methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3760US12428721B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2022·Granted Sep 30, 2025·0 cites·18 claims
- 3860US7063871B2CVD process capable of reducing incubation timeTOKYO ELECTRON LTD·Filed 2003·Granted Jun 20, 2006·4 cites·11 claims
- 3957US11602856B2Vacuum transfer device and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Mar 14, 2023·0 cites·16 claims
- 4057US6126994ALiquid material supply apparatus and methodTOKYO ELECTRON LTD·Filed 1997·Granted Oct 3, 2000·16 cites·6 claims
- 4156US2023183854A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4255US2011263123A1Placing table structureTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 4354US9062374B2Method for film formation, apparatus for film formation, and computer-readable recording mediumHARA MASAMICHI·Filed 2009·Granted Jun 23, 2015·0 cites·12 claims
- 4453US12327744B2Substrate transfer device and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Jun 10, 2025·0 cites·13 claims
- 4553US2013081938A1Magnetron sputtering apparatus and methodMIZUNO SHIGERU·Filed 2012·Application pending·0 cites
- 4653US2022259727A1Substrate heating device, substrate heating method, and method of manufacturing substrate heaterTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 4752US11404255B2Sputtering method and sputtering apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 4852US2014287163A1Method of forming copper wiring and method and system for forming copper filmTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 4951US11251027B2Stage device and processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Feb 15, 2022·0 cites·12 claims
- 5050US11410837B2Film-forming deviceTOKYO ELECTRON LTD·Filed 2017·Granted Aug 9, 2022·0 cites·3 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →