Inventor · disambiguated record
Jung-Su Ryu
Also filed as: RYU JUNG-SU
3 granted patents·5 pending applications·23 citations·filing 2003–2007
67Inventor score
Top patents by PatentIndex Score
8 records- 0169US7224176B2Semiconductor device having test element groupsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 29, 2007·16 cites·17 claims
- 0263US7429794B2Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chipSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 30, 2008·3 cites·20 claims
- 0350US6949837B2Bonding pad arrangement method for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 27, 2005·4 cites·18 claims
- 0443US2005194664A1Bonding pad arrangement method for semiconductor devicesFiled 2005·Application pending·0 cites
- 0538US2007152316A1Interposer pattern with pad chainSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0637US2007018300A1Apparatus and method for testing a multi-stack integrated circuit packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0736US2007018340A1Integrated circuit pad with separate probing and bonding areasKIM YOUNG-DAE·Filed 2006·Application pending·0 cites
- 0832US2005052799A1ESD protecting circuit embedded in an SIP chip using a plurality of power sourcesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →