Inventor · disambiguated record
Brent Boudreaux
Also filed as: BOUDREAUX BRENT · BOUDREAUX BRENT A · BOUDREAUX BRENT ALLEN
32 granted patents·3 pending applications·728 citations·filing 2001–2015
98Inventor score
Top patents by PatentIndex Score
35 records- 0198US7197806B2Fastener for variable mountingHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Apr 3, 2007·82 cites·8 claims
- 0296US6540531B2Clamp system for high speed cable terminationHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Apr 1, 2003·159 cites·17 claims
- 0393US7286352B2Thermally expanding base of heatsink to receive finsHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Oct 23, 2007·28 cites·20 claims
- 0492US6947286B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Sep 20, 2005·15 cites·20 claims
- 0591US6816378B1Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 9, 2004·40 cites·38 claims
- 0690US6819562B2Cooling apparatus for stacked componentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Nov 16, 2004·57 cites·12 claims
- 0789US6771507B1Power module for multi-chip printed circuit boardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Aug 3, 2004·55 cites·7 claims
- 0887US7345885B2Heat spreader with multiple stacked printed circuit boardsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 18, 2008·38 cites·18 claims
- 0983US6958445B1Electromagnetic interference shield for electronic devices on a circuit boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 25, 2005·27 cites·35 claims
- 1078US7131199B2Mechanical highly compliant thermal interface padHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Nov 7, 2006·4 cites·17 claims
- 1178US7096926B2Thermal pouch interfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Aug 29, 2006·21 cites·10 claims
- 1274US7567438B1Heat sink with precompressed bias memberHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jul 28, 2009·6 cites·25 claims
- 1373US7475175B2Multi-processor moduleHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jan 6, 2009·19 cites·40 claims
- 1473US6748458B2Modular input/output expansion system for an external computerHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jun 8, 2004·22 cites·19 claims
- 1572US7385824B2Processor module with rigidly coupled processor and voltage-regulator heat sinksHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 10, 2008·4 cites·12 claims
- 1672US6862186B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 1, 2005·10 cites·11 claims
- 1771US6910271B2Mechanical highly compliant thermal interface padHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jun 28, 2005·10 cites·27 claims
- 1871US6900987B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted May 31, 2005·9 cites·25 claims
- 1971US6873530B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Mar 29, 2005·9 cites·16 claims
- 2070US6625026B1Heat-activated self-aligning heat sinkHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 23, 2003·17 cites·44 claims
- 2167US6695042B1Adjustable pedestal thermal interfaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Feb 24, 2004·14 cites·35 claims
- 2266US6922340B2Stack up assemblyHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 26, 2005·7 cites·12 claims
- 2366US6623303B2Cable shield termination system using clamps and ferrulesHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Sep 23, 2003·16 cites·18 claims
- 2465US6545220B2Shielded cable system for high speed cable terminationHEWLETT PACKARD CO·Filed 2001·Granted Apr 8, 2003·17 cites·15 claims
- 2563US7028754B2High surface area heat sinkHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Apr 18, 2006·10 cites·18 claims
- 2661US7450400B2Electronic system and methodHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Nov 11, 2008·10 cites·19 claims
- 2758US7117929B2Heat sinkHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Oct 10, 2006·6 cites·35 claims
- 2855US6675720B2Management system for multiple cablesHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Jan 13, 2004·12 cites·19 claims
- 2946US7347713B2Alignment systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 25, 2008·1 cites·25 claims
- 3046US2004156676A1Fastener for variable mountingFiled 2003·Application pending·0 cites
- 3145US2005219820A1System and method for heat dissipationBELADY CHRISTIAN L·Filed 2004·Application pending·0 cites
- 3244US9941567B2Integrated PCB interconnect systemL 3 COMM CORP·Filed 2015·Granted Apr 10, 2018·0 cites·25 claims
- 3343US6527582B1Cable bundle clampHEWLETT PACKARD CO·Filed 2001·Granted Mar 4, 2003·2 cites·12 claims
- 3440US7018215B2Routing systemHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 28, 2006·1 cites·12 claims
- 3539US2003178174A1Thermal pouch interfaceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →