US2003178174A1PendingUtilityA1

Thermal pouch interface

Priority: Mar 21, 2002Filed: Mar 21, 2002Published: Sep 25, 2003
Est. expiryMar 21, 2022(expired)· nominal 20-yr term from priority
H10W 40/77F28F 23/00H05K 3/0058
39
PatentIndex Score
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Cited by
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Claims

Abstract

A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A thermal pouch comprising: 
 a quantity of low melting point, thermally conductive material;    a top sheet of flexible, thermally conductive material; and    a bottom sheet of flexible, thermally conductive material, sealed with said top sheet forming a thermal pouch surrounding said quantity of low melting point, thermally conductive material.    
     
     
         2 . The thermal pouch recited in  claim 1 , wherein said low melting point, thermally conductive material has a melting point below a melting point of solder used to attach electrical components in an assembly.  
     
     
         3 . The thermal pouch recited in  claim 1 , wherein said low melting point, thermally conductive material comprises solder.  
     
     
         4 . The thermal pouch recited in  claim 1 , wherein said low melting point, thermally conductive material comprises mercury.  
     
     
         5 . The thermal pouch recited in  claim 1 , further comprising: 
 a quantity of springy material within said top sheet and bottom sheet substantially surrounded by said quantity of low melting point, thermally conductive material after melting of said quantity of low melting point, thermally conductive material.    
     
     
         6 . The thermal pouch recited in  claim 5 , wherein said springy material is one or more springs.  
     
     
         7 . The thermal pouch recited in  claim 5 , wherein said springy material is metal wool.  
     
     
         8 . The thermal pouch recited in  claim 7 , wherein said metal wool is steel wool.  
     
     
         9 . The thermal pouch recited in  claim 7 , wherein said metal wool is copper wool.  
     
     
         10 . The thermal pouch recited in  claim 5 , wherein said springy material is solder compatible plastic.  
     
     
         11 . The thermal pouch recited in  claim 1 , wherein said top sheet and said bottom sheet are mylar.  
     
     
         12 . The thermal pouch recited in  claim 1 , wherein said top sheet and said bottom sheet are thin metal foil.  
     
     
         13 . The thermal pouch recited in  claim 12 , wherein said thin metal foil is aluminum.  
     
     
         14 . The thermal pouch recited in  claim 12 , wherein said thin metal foil is copper.  
     
     
         15 . The thermal pouch recited in  claim 1 , wherein said top sheet and said bottom sheet are soldered to each other forming said thermal pouch.  
     
     
         16 . The thermal pouch recited in  claim 1 , wherein said top sheet and said bottom sheet are glued to each other forming said thermal pouch.  
     
     
         17 . The thermal pouch recited in  claim 1 , wherein said top sheet and said bottom sheet are welded to each other forming said thermal pouch.  
     
     
         18 . The thermal pouch recited in  claim 1 , wherein an outer surface of said thermal pouch is coated with thermal grease.  
     
     
         19 . The thermal pouch recited in  claim 1 , wherein an outer surface of said thermal pouch is coated with a phase change material.  
     
     
         20 . The thermal pouch recited in  claim 1 , wherein an outer surface of said thermal pouch is coated with solder.  
     
     
         21 . A method for constructing a thermal pouch, comprising the steps of: 
 a) creating a top sheet of flexible, thermally conductive material;    b) creating a bottom sheet of flexible, thermally conductive material;    c) placing a quantity of low melting point, thermally conductive material between said top sheet and said bottom sheet; and    d) affixing said top sheet to said bottom sheet, forming a thermal pouch.    
     
     
         22 . The method for constructing a thermal pouch recited in  claim 21 , wherein said low melting point, thermally conductive material is solder.  
     
     
         23 . The method for constructing a thermal pouch recited in  claim 21 , wherein said low melting point, thermally conductive material is mercury.  
     
     
         24 . The method for constructing a thermal pouch recited in  claim 21 , wherein said flexible, thermally conductive material is aluminum.  
     
     
         25 . The method for constructing a thermal pouch recited in  claim 21 , wherein said flexible, thermally conductive material is copper.  
     
     
         26 . The method for constructing a thermal pouch recited in  claim 21 , wherein said flexible, thermally conductive material is mylar.  
     
     
         27 . The method for constructing a thermal pouch recited in  claim 21 , further comprising the step of: 
 e) placing a quantity of springy material between said top sheet and said bottom sheet.    
     
     
         28 . The method for constructing a thermal pouch recited in  claim 27 , wherein said springy material is at least one spring.  
     
     
         29 . The method for constructing a thermal pouch recited in  claim 27 , wherein said springy material is metal wool.  
     
     
         30 . The method for constructing a thermal pouch recited in  claim 29 , wherein said metal wool is steel wool.  
     
     
         31 . The method for constructing a thermal pouch recited in  claim 29 , wherein said metal wool is copper wool.  
     
     
         32 . The method for constructing a thermal pouch recited in  claim 21 , further comprising the step of: 
 e) coating an outer surface of said thermal pouch with thermal grease.    
     
     
         33 . The method for constructing a thermal pouch recited in  claim 21 , further comprising the step of: 
 e) coating an outer surface of said thermal pouch with phase change material.    
     
     
         34 . The method for constructing a thermal pouch recited in  claim 21 , further comprising the step of: 
 e) coating an outer surface of said thermal pouch with solder.    
     
     
         35 . The method for constructing a thermal pouch recited in  claim 21 , further comprising the steps of: 
 e) heating said thermal pouch to a temperature above a melting point of said low melting point, thermally conductive material; and    f) compressing said thermal pouch between at least two components while said low melting point, thermally conductive material is a liquid.

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