Inventor · disambiguated record
Christian Klewer
Also filed as: KLEWER CHRISTIAN
4 granted patents·1 pending application·219 citations·filing 2014–2017
70Inventor score
Technology areasH10W
Files withGLOBALFOUNDRIES INC5
Top patents by PatentIndex Score
5 records- 0195US9536848B2Bond pad structure for low temperature flip chip bondingGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 3, 2017·219 cites·6 claims
- 0248US9659840B2Process flow for a combined CA and TSV oxide depositionGLOBALFOUNDRIES INC·Filed 2014·Granted May 23, 2017·0 cites·14 claims
- 0345US10068835B2Process flow for a combined CA and TSV oxide depositionGLOBALFOUNDRIES INC·Filed 2017·Granted Sep 4, 2018·0 cites·11 claims
- 0445US2017040274A1Bond pad structure for low temperature flip chip bondingGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
- 0535US9570430B2Articles including bonded metal structures and methods of preparing the sameGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 14, 2017·0 cites·14 claims
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