Inventor · disambiguated record
Ian En Yoon Chin
Also filed as: CHIN IAN EN YOON
4 granted patents·1 pending application·3 citations·filing 2007–2022
64Inventor score
Top patents by PatentIndex Score
5 records- 0186US11322457B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2020·Granted May 3, 2022·2 cites·17 claims
- 0273US12009318B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2022·Granted Jun 11, 2024·0 cites·23 claims
- 0361US9941219B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2014·Granted Apr 10, 2018·1 cites·12 claims
- 0454US10658307B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 0535US2009016036A1Conductor reinforcement for circuit boardsWONG SHAW FONG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →