Assignee
WONG SHAW FONG
MY·0 granted patents·2 pending applications·0 citations·filing 2007–2010
Top patents by PatentIndex Score
2 records- 0135US2009016036A1Conductor reinforcement for circuit boardsWONG SHAW FONG·Filed 2007·Application pending·0 cites
- 0230US2012159118A1Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package StructureWONG SHAW FONG·Filed 2010·Application pending·0 cites
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