Inventor · disambiguated record
Joungun Park
Also filed as: PARK JOUNGUN
3 granted patents·1 pending application·20 citations·filing 2008–2012
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0179US8035211B2Integrated circuit package system with support structure under wire-in-film adhesiveSTATS CHIPPAC LTD·Filed 2008·Granted Oct 11, 2011·12 cites·20 claims
- 0275US9123663B2Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductorKIM OHHAN·Filed 2008·Granted Sep 1, 2015·8 cites·24 claims
- 0349US8137995B2Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structuresKIM OHHAN·Filed 2008·Granted Mar 20, 2012·0 cites·21 claims
- 0444US2012153452A1Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect StructuresKIM OHHAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →